Imaging device including lines for each column

ABSTRACT

An imaging device that includes pixels arranged in a matrix having rows and columns, the pixels including first pixels and second pixels different from the first pixels, the first pixels and the second pixels being located in one of the columns, each of the pixels including a photoelectric converter that converts incident light into signal charge, and a first transistor having a first gate, a first source and a first drain, the first gate being coupled to the photoelectric converter. The imaging device further includes a first line coupled to one of the first source and drain of the first pixels; a second line coupled to one of the first source and drain of the second pixels; a third line coupled to the other of the first source and drain of the first pixels; and voltage circuitry coupled to the third line and that supplies a first and second voltage.

CROSS REFERENCE

This application is a Continuation of U.S. patent application Ser. No.16/250,264 filed Jan. 17, 2019, which is a Continuation of U.S. patentapplication Ser. No. 15/407,084 filed on Jan. 16, 2017, now U.S. Pat.No. 10,225,500, which claims the benefit of Japanese Application No.2016-010444 filed on Jan. 22, 2016, the entire contents of each arehereby incorporated by reference.

BACKGROUND 1. Technical Field

The present disclosure relates to an imaging device.

2. Description of the Related Art

Charge-coupled device (CCD) image sensors and complementarymetal-oxide-semiconductor (CMOS) image sensors are being used widely indevices such as digital cameras. As is well known, these image sensorsinclude photodiodes formed on a semiconductor substrate. Otherwise, astructure is known in which photoelectric converters including aphotoelectric conversion layer are arranged above a semiconductorsubstrate. For example, Japanese Unexamined Patent ApplicationPublication No. 2011-228621 discloses a solid-state image sensor elementin which photoelectric converter elements P including a photoelectricconversion layer are arranged on top of an insulating layer 20 coveringa semiconductor substrate 10 on which a signal readout circuit 11 isformed (see FIG. 2). With a so-called laminated structure like theabove, the photoelectric converters are arranged above the signalreadout circuit, and thus the aperture ratio is easily maintained.Consequently, such a structure has the advantage of enabling higherpixel densities.

In the field of imaging devices, there is demand for noise reduction. Inparticular, there is demand to reduce the kTC noise produced whenresetting the electric charge generated by photoelectric conversion(also called “reset noise”). U.S. Pat. No. 6,532,040 proposes thecancellation of reset noise by providing a feedback amplifier on eachpixel column in the imaging area, and forming a feedback path thatincludes the feedback amplifiers. The entire contents of U.S. Pat. No.6,532,040 are incorporated by reference herein.

SUMMARY

Reset noise cancellation by the formation of a feedback path as proposedin U.S. Pat. No. 6,532,040 requires a long time compared to signalreadout. For this reason, achieving both reset noise cancellation by theformation of a feedback path and frame rate improvement is difficult ingeneral.

In one general aspect, the techniques disclosed here feature an imagingdevice that includes pixels arranged in a matrix having rows andcolumns, the pixels including first pixels and second pixels differentfrom the first pixels, the first pixels and the second pixels beinglocated in one of the columns, each of the pixels comprising: aphotoelectric converter that converts incident light into signal charge,and a first transistor having a first gate, a first source and a firstdrain, the first gate being coupled to the photoelectric converter. Theimaging device further including a first line coupled to one of thefirst source and the first drain of each of the first pixels; a secondline coupled to one of the first source and the first drain of each ofthe second pixels, the second line being different from the first line;a third line coupled to the other of the first source and the firstdrain of each of the first pixels; and voltage circuitry that is coupledto the third line and that supplies a first voltage and a second voltagedifferent from the first voltage, wherein the first pixels are arrangedevery n rows in the one of the columns, and the second pixels arearranged every n rows in the one of the columns, where n is an integerequal to or greater than two, the rows respectively having the firstpixels being different from those respectively having the second pixels.

It should be noted that general or specific embodiments may beimplemented as an element, a device, a module, a system, an integratedcircuit, a method, a computer program, or any selective combinationthereof.

Additional benefits and advantages of the disclosed embodiments willbecome apparent from the specification and drawings. The benefits and/oradvantages may be individually obtained by the various embodiments andfeatures of the specification and drawings, which need not all beprovided in order to obtain one or more of such benefits and/oradvantages.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram illustrating an overview of an exemplary circuitconfiguration of an imaging device according to a first embodiment ofthe present disclosure;

FIG. 2 is a schematic diagram illustrating an example of a drivingsequence for multiple pixel cells belonging to a certain column in apixel array PA;

FIG. 3 is a diagram illustrating an imaging device of a comparativeexample that includes a circuit configuration in which all pixel cellsbelonging to the same column are connected to a common output signalline;

FIG. 4 is a diagram illustrating in further detail the drive timings ofpixel cells on respective rows in the driving sequence illustrated inFIG. 2;

FIG. 5 is a diagram illustrating an example of the circuit configurationof a pixel cell;

FIG. 6 is a diagram illustrating a typical example of the changes in thecontrol signals for each transistor and each switching element in theoperational example described with reference to FIG. 4;

FIG. 7 is a conceptual diagram illustrating another example ofoperations in an imaging device;

FIG. 8 is a diagram illustrating in further detail the drive timings onrespective rows of pixel cells, in the case of applying the secondoperational example outlined in FIG. 7 to the acquisition of digitalimage data;

FIG. 9 is a diagram illustrating a typical example of the changes in thecontrol signals for each transistor and each switching element in thesecond operational example outlined in FIG. 7;

FIG. 10 is a conceptual diagram illustrating yet another example ofoperations in an imaging device;

FIG. 11 is a diagram illustrating in further detail the drive timings onrespective rows of pixel cells, in the case of applying the thirdoperational example outlined in FIG. 10 to the acquisition of digitalimage data;

FIG. 12 is a diagram illustrating a typical example of the changes inthe control signals for each transistor and each switching element inthe third operational example outlined in FIG. 10;

FIG. 13 is a diagram illustrating an overview of an exemplary circuitconfiguration of an imaging device according to a second embodiment ofthe present disclosure;

FIG. 14 is a diagram illustrating a typical example of the changes inthe control signals for each transistor and each switching element, inthe case of applying the second operational example outlined in FIG. 7to an imaging device;

FIG. 15 is a diagram illustrating an overview of an exemplary circuitconfiguration of an imaging device according to a third embodiment ofthe present disclosure;

FIG. 16 is a diagram illustrating an overview of an exemplary circuitconfiguration of an imaging device according to a third embodiment ofthe present disclosure;

FIG. 17 is a diagram illustrating a typical example of the changes inthe control signals for each transistor and each switching element whenapplying the first operational example described with reference to FIG.4 to an imaging device;

FIG. 18 is a diagram illustrating a typical example of the changes inthe control signals for each transistor and each switching element, inthe case of applying the second operational example outlined in FIG. 7to an imaging device;

FIG. 19 is a diagram illustrating another example of a readout circuit;

FIG. 20 is a diagram illustrating a state in which the switching circuitconnections have been changed in the readout circuit illustrated in FIG.19;

FIG. 21 is a diagram illustrating another example of the circuitconfiguration of a pixel cell, which is applicable to the first andsecond embodiments;

FIG. 22 is a diagram illustrating another example of the circuitconfiguration of a pixel cell, which is applicable to the thirdembodiment;

FIG. 23 is a diagram for explaining the effects obtained by alternatelyarranging, in the column direction on the same column of multiple pixelcells, a pixel cell connected to a first output signal line and a pixelcell connected to a second output signal line;

FIG. 24 is a diagram for explaining the effects obtained by alternatelyarranging, in the column direction on the same column of multiple pixelcells, a pixel cell connected to a first output signal line and a pixelcell connected to a second output signal line;

FIG. 25 is a diagram illustrating an overview of an exemplary circuitconfiguration of an imaging device according to an embodiment providedwith four output signal lines for each column;

FIG. 26 is a block diagram illustrating an example configuration of acamera system including an imaging device according to an embodiment ofthe present disclosure; and

FIG. 27 is a diagram illustrating an overview of an exemplary circuitconfiguration of an imaging device according to a modification of thethird embodiment of the present disclosure.

DETAILED DESCRIPTION

An overview of aspects of the present disclosure is given below.

-   [Item 1]

An imaging device, comprising:

pixel cells arranged in a matrix having rows and columns, each of thepixel cells comprising a photoelectric converter and a signal detectioncircuit that detects an electrical signal generated in the photoelectricconverter and outputs an output signal, the pixel cells including firstpixel cells and second pixel cells located in one of the columns;

a first output signal line through which the output signal is outputfrom each of the first pixel cells;

a second output signal line through which the output signal is outputfrom each of the second pixel cells;

a first feedback circuit that forms, for each of the first pixel cells,a first feedback path that negatively feeds back the electrical signal;and

a second feedback circuit that forms, for each of the second pixelcells, a second feedback path that negatively feeds back the electricalsignal, wherein

The first pixel cells are arranged every n rows in the one of thecolumns, and the second pixel cells are arranged every n rows in the oneof the columns, where n is an integer equal to or greater than two, therows respectively having the first pixel cells being different fromthose respectively having the second pixel cells.

According to the configuration of Item 1, while conducting the readoutof a signal from one pixel cell, a feedback path may be formed foranother pixel cell belonging to the same column.

-   [Item 2]

The imaging device according to Item 1, wherein

the photoelectric converter comprises a pixel electrode, an counterelectrode, and a photoelectric conversion layer located between thepixel electrode and the counter electrode,

the signal detection circuit comprises a signal detection transistorhaving a gate electrically connected to the pixel electrode,

the first feedback circuit includes, in each of the first pixel cells,the signal detection transistor as a part of the first feedback path,and

the second feedback circuit includes, in each of the second pixel cells,the signal detection transistor as a part of the second feedback path.

According to the configuration of Item 2, the output of a signaldetection transistor may be fed back.

-   [Item 3]

The imaging device according to Item 2, wherein

the signal detection circuit comprises a feedback transistor one of asource and a drain of which is electrically connected to the pixelelectrode,

the first feedback circuit negatively feeds back, for each of the firstpixel cells, an output of the signal detection transistor to the otherof the source and the drain of the feedback transistor, and

the second feedback circuit negatively feeds back, for each of thesecond pixel cells, an output of the signal detection transistor to theother of the source and the drain of the feedback transistor.

According to the configuration of Item 3, band limiting using a feedbacktransistor may be executed.

-   [Item 4]

The imaging device according to Item 1, wherein

the first feedback circuit comprises a first inverting amplifier,

the second feedback circuit comprises a second inverting amplifier,

the first feedback circuit includes a part of the first output signalline and the first inverting amplifier as a part of the first feedbackpath, and

the second feedback circuit includes a part of the second output signalline and the second inverting amplifier as a part of the second feedbackpath.

-   [Item 5]

The imaging device according to Item 4, further comprising:

a reference-signal generator that generates a reference signal to besupplied to an input terminal of the first inverting amplifier and aninput terminal of the second inverting amplifier, wherein

the reference-signal generator is located outside a region in which thepixel cells are arranged in the matrix.

According to the configuration of Item 5, the reference-signal generatoris arranged outside the pixel array, and thus has the advantage ofenabling higher pixel densities.

-   [Item 6]

The imaging device according to Item 5, further comprising:

a column circuit electrically connected to the first output signal lineand the second output signal line to receive the output signal from eachof the first and second pixel cells, and electrically connected to thereference-signal generator to receive the reference signal forprocessing the output signal.

According to the configuration of Item 6, a noise silencing processusing a reference signal as a dark level may be executed.

Hereinafter, exemplary embodiments of the present disclosure will bedescribed in detail and with reference to the drawings. Note that theexemplary embodiments described hereinafter all illustrate general orspecific examples. Features such as numerical values, shapes, materials,structural elements, arrangements and connection states of structuralelements, steps, and the ordering of steps indicated in the followingexemplary embodiments are merely examples, and are not intended to limitthe present disclosure. The various aspects described in thisspecification may also be combined with each other in non-contradictoryways. In addition, among the structural elements in the followingexemplary embodiments, structural elements that are not described in theindependent claim indicating the broadest concept are described asarbitrary or optional structural elements. In the following description,structural elements having substantially the same functions will bedenoted by shared reference signs, and the description of suchstructural elements may be reduced or omitted.

First Embodiment

FIG. 1 illustrates an overview of an exemplary circuit configuration ofan imaging device according to a first embodiment of the presentdisclosure. The imaging device 100 illustrated in FIG. 1 includes apixel array PA including multiple pixel cells 10, and peripheralcircuits. The multiple pixel cells 10 constituting the pixel array PAare arrayed in a matrix having multiple rows and multiple columns.

The number of pixel cells 10 in the pixel array PA may be approximatelyfrom several million to several tens of millions, for example. In FIG.1, to keep the diagram from becoming overly complex, a group of twopixel cells 10 in the row direction and three in the column direction,for a total of six, are illustrated as a representative example. In thisspecification, the row direction and the column direction refer to thedirections in which the rows and columns extend, respectively. In otherwords, in the drawings, the up-and-down direction on the page is thecolumn direction, while the left-and-right direction is the rowdirection. Note that FIG. 1 is merely a diagrammatic illustration of thearrangement of the pixel cells 10, and the multiple pixel cells 10arranged in the row direction are not required to be arranged strictlyin a straight line. For example, between two pixel cells adjacent toeach other in the row direction, the center of one pixel cell may beoffset from the center of the other pixel cell by approximately half thepixel pitch in the column direction. Similarly, the multiple pixel cells10 arranged in the column direction are not required to be arrangedstrictly in a straight line in the column direction.

The multiple pixel cells 10 form an imaging area by being arrayedtwo-dimensionally on a semiconductor substrate, for example. In thefollowing, certain rows and/or certain columns in the pixel array PAwill be denoted with the use of subscripts. For example, the pixel cell10 positioned on the (i)th row and the (j)th column may be denoted thepixel cell 10 _(i,j) (where i and j are integers equal to or greaterthan 1).

In an embodiment of the present disclosure, a pair made up of a firstoutput signal line 30 a and a second output signal line 30 b is providedfor each column of pixel cells 10. For example, for the (j)th column ofthe pixel array PA, a first output signal line 30 a _(j) and a secondoutput signal line 30 b _(j) extending in the column direction aredisposed, while for the (j+1)th column, a first output signal line 30 a_(j+1) and a second output signal line 30 b _(j+1) extending in thecolumn direction are disposed. A constant current source made up of aload transistor and the like is connected to one end of each outputsignal line. In the illustrated example, constant current sources 40 a_(j) and 40 b _(j) are connected respectively to one end of the firstoutput signal line 30 a _(j) and the second output signal line 30 b _(j)of the (j)th column. Constant current sources 40 a _(j+1) and 40 b_(j+1) are connected respectively to one end of the first output signalline 30 a _(j+1) and the second output signal line 30 b _(j+1) of the(j+1)th column.

Each pixel cell 10 has a connection to one of the first output signalline 30 a and the second output signal line 30 b. In other words, eachcolumn of pixel cells 10 includes one or more pixel cells 10 having aconnection to the first output signal line 30 a, and one or more pixelcells 10 having a connection to the second output signal line 30 b. Inthis example, among the multiple pixel cells 10 belonging to the (j)thcolumn, the pixel cell 10 _(i,j) on the (i)th row and the pixel cell 10_(i+2,j) on the (i+2)th row are connected to the first output signalline 30 a _(j), while the pixel cell 10 _(i+i,j) on the (i+1)th row isconnected to the second output signal line 30 b _(j). Also, in thisexample, among the multiple pixel cells 10 belonging to the (j+1)thcolumn, similarly to the (j)th column, the pixel cell 10 _(i,j+1) on the(i)th row and the pixel cell 10 _(i+2,j+1) on the (i+2)th row areconnected to the first output signal line 30 a _(j+1), while the pixelcell 10 _(i+1, j+1) on the (i+1)th row is connected to the second outputsignal line 30 b _(j+1). In other words, in this example, the pixelcells 10 on odd-numbered rows (or even-numbered rows) in the pixel arrayPA are connected to the first output signal line 30 a, while the pixelcells 10 on the even-numbered rows (or odd-numbered rows) are connectedto the second output signal line 30 b.

As discussed later, each of the pixel cells 10 includes a photoelectricconverter, and a signal detection circuit that detects an electricalsignal produced by the photoelectric converter. The signal detectioncircuit of each pixel cell 10 typically includes an address transistor.By switching on the address transistor, the output signal from a desiredpixel cell 10 may be read out to the corresponding output signal line.

As illustrated diagrammatically in FIG. 1, switching on and off in theaddress transistor may be controlled in units of rows by using anaddress control signal SEL. Typically, the address control signal SEL issupplied from a vertical scan circuit (not illustrated) disposed as aperipheral circuit. By selecting the pixel cells 10 in units of row byusing the address control signal SEL, signals may be read out from thepixel cells 10 to the corresponding output signal line in units of rows.Herein, the output of each pixel cell 10 belonging to an odd-numberedrow (or even-numbered row) is read out via the first output signal line30 a, while the output of each pixel cell 10 belonging to aneven-numbered row (or odd-numbered row) is read out via the secondoutput signal line 30 b.

In the configuration illustrated as an example in FIG. 1, the firstoutput signal line 30 a and the second output signal line 30 b for eachcolumn of the pixel cells 10 are connected to a switching circuit 41. Asillustrated, the switching circuit 41 is connected between the pair ofthe first output signal line 30 a and the second output signal line 30b, and a column circuit 44 provided in correspondence with each columnof the pixel cells 10. In the configuration illustrated as an exampleherein, a second switching circuit 42 is connected between the switchingcircuit 41 and the column circuit 44.

The switching circuit 41 includes a first switching element S1 connectedto the first output signal line 30 a and a second switching element S2connected to the second output signal line 30 b. The first switchingelement S1 and the second switching element S2 are controlled to operatein a complementary manner. Namely, when the first switching element S1is on, the second switching element S2 is off, and when the firstswitching element S1 is off, the second switching element S2 is on. Whenthe first switching element S1 is on, a connection is establishedbetween the first output signal line 30 a and the second switchingcircuit 42, and the voltage VSIGa of the first output signal line 30 ais input into the switching circuit 42. When the second switchingelement S2 is on, a connection is established between the second outputsignal line 30 b and the switching circuit 42, and the voltage VSIGb ofthe second output signal line 30 b is input into the switching circuit42.

The switching circuit 42 includes a third switching element S3 and afourth switching element S4. The fourth switching element S4 isconnected between the column circuit 44 and the switching circuit 41.The third switching element S3 is connected between the column circuit44, and a reference voltage line 46 to which a reference voltage VREF isapplied during operation of the imaging device 100. The first switchingelement S1, the second switching element S2, the third switching elementS3, and the fourth switching element S4 are field-effect transistors(FETs), for example.

The reference voltage line 46 is connected to a voltage supply circuit48 that supplies the reference voltage VREF. The voltage supply circuit48 is not limited to a specific power supply circuit. The voltage supplycircuit 48 may be a circuit that generates the reference voltage VREF,or a circuit that converts a voltage supplied from another power supplyinto the reference voltage VREF. As illustrated, disposing the voltagesupply circuit 48 that supplies the reference voltage VREF outside thepixel array PA has the advantage of enabling higher pixel densities. Thereference voltage VREF is a voltage corresponding to the reset voltageof the pixel cells 10.

The third switching element S3 and the fourth switching element S4 inthe switching circuit 42 are controlled to operate in a complementarymanner, similarly to the first switching element S1 and the secondswitching element S2 discussed above. Namely, when the fourth switchingelement S4 is on, a connection is established between the switchingcircuit 41 and the column circuit 44, thereby causing one of the voltageVSIGa of the first output signal line 30 a and the voltage VSIGb of thesecond output signal line 30 b to be supplied to the column circuit 44as an input VIN. On the other hand, when the third switching element S3is on, a connection is established between the reference voltage line 46and the column circuit 44, and the reference voltage VREF is supplied tothe column circuit 44.

The column circuit 44 conducts processing such as noise suppressionsignal processing as typified by correlated double sampling, andanalog-to-digital conversion (AD conversion). In this example, it ispossible to supply the reference voltage VREF discussed above to thecolumn circuit 44, and the reference voltage VREF may be utilized in thenoise suppression signal processing. The output of the column circuit 44is supplied to a horizontal signal readout circuit (not illustrated).The horizontal signal readout circuit successively reads out signalsfrom the multiple column circuits 44 to a horizontal common signal line(not illustrated).

The imaging device 100 includes a first feedback circuit FCa and asecond feedback circuit FCb. In this example, the first feedback circuitFCa and the second feedback circuit FCb are provided for each column ofthe pixel cells 10. For example, the first feedback circuit FCa_(j) onthe (j)th column forms a first feedback path that negatively feeds backthe electrical signals produced by the photoelectric converters of thepixel cells 1 _(p,j) (herein, p=i, i+2, i+4, . . . ) connected to thefirst output signal line 30 a _(j). Additionally, the second feedbackcircuit FCb_(j) on the (j)th column forms a second feedback path thatnegatively feeds back the electrical signals produced by thephotoelectric converters of the pixel cells 10 _(q,j) (herein, q=i+1,i+3, i+5, . . . ) connected to the second output signal line 30 b _(j).Note that the formation of the first feedback path during operation ofthe imaging device 100 is not executed simultaneously for all of thepixel cells 10 _(p,j) connected to the first output signal line 30 a_(j), but instead is executed sequentially one by one. Similarly, theformation of the second feedback path during operation of the imagingdevice 100 is not executed simultaneously for all of the pixel cells 10_(q,j) connected to the second output signal line 30 b _(j), but insteadis executed sequentially one by one.

In the example illustrated in FIG. 1, the first feedback circuit FCa andthe second feedback circuit FCb include a first inverting amplifier 50 aand a second inverting amplifier 50 b, respectively. As illustrated, thefirst output signal line 30 a is connected to the inverting inputterminal of the first inverting amplifier 50 a. A first feedback line 52a is connected to the output terminal of the first inverting amplifier50 a. The pixel cells 10 having a connection to the first output signalline 30 a are connected to the first feedback line 52 a. Meanwhile, theinverting input terminal of the second inverting amplifier 50 b isconnected to the second output signal line 30 b. A second feedback line52 b is connected to the output terminal of the second invertingamplifier 50 b, and the pixel cells 10 having a connection to the secondoutput signal line 30 b are connected to the second feedback line 52 b.

Taking the (j)th column as an example, the pixel cell 10 _(i,j) and thepixel cell 10 _(i+2,j) having a connection to the first output signalline 30 a have a connection to the first feedback line 52 a _(j), whilethe pixel cell 10 _(i+1,j) having a connection to the second outputsignal line 30 b has a connection to the second feedback line 52 b _(j).If the pixel cell 10 _(i,j) on the (i)th row is selected by the controlof the address control signal SEL_(i), for example, the signal from thepixel cell 10 _(i,j) is input into the first inverting amplifier 50 a_(j) via the first output signal line 30 a _(j), and the output FBOa_(j)of the first inverting amplifier 50 a _(j) is fed back into the pixelcell 10 _(i,j) via the first feedback line 52 a _(j). In other words, inthis example, the first feedback circuit FCa includes part of the firstoutput signal line 30 a and the first inverting amplifier 50 a as partof the first feedback path. Similarly, if the pixel cell 10 _(1+1, j) onthe (i+1)th row is selected, for example, the signal from the pixel cell10 _(i+1,j) is input into the second inverting amplifier 50 b _(j) viathe second output signal line 30 b _(i), and the output FBOb_(j) of thesecond inverting amplifier 50 b _(j) is fed back into the pixel cell 10_(i+1,j) via the second feedback line 52 b _(j). In other words, in thisexample, the second feedback circuit FCb includes part of the secondoutput signal line 30 b and the second inverting amplifier 50 b as partof the second feedback path.

Note that in this example, the non-inverting input terminals of thefirst inverting amplifier 50 a and the second inverting amplifier 50 bare both connected to the reference voltage line 46. Consequently,during the formation of the first feedback path, the voltage of thefirst output signal line 30 a converges on the reference voltage VREF.Also, during the formation of the second feedback path, the voltage ofthe second output signal line 30 b converges on the reference voltageVREF. As discussed later, in this example, the reference voltage VREF isutilized as a reference voltage for reset. The specific value of thereference voltage VREF may be set to an arbitrary value within the rangebetween the power supply voltage (3.3 V, for example) and ground (0 V).

(First Operational Example in Imaging Device 100)

FIG. 2 is a conceptual diagram illustrating an example of operations inthe imaging device 100. The horizontal axis T in FIG. 2 represents time,and FIG. 2 diagrammatically illustrates a driving sequence of multiplepixel cells 10 belonging to a certain column in the pixel array PA.Specifically, Row₁, Row₂, Row_(k), Row_(k+1), and Row_(k+2) in FIG. 2represent the driving sequences for the pixel cells 10 on the 1st row,the 2nd row, the kth row, the (k+1)th row, and the (k+2)th row,respectively. Herein, k is an even number greater than 1.

During image capture, first, a reset is executed for each pixel cell 10.The reset is a process for releasing signal charge remaining in a chargeaccumulation region for accumulating signal charge to the outside of thecharge accumulation region, and setting the electric potential of thecharge accumulation region to a certain reset voltage. Typically, atransistor (called a reset transistor) disposed between the chargeaccumulation region and the supply source of the reset voltage isswitched on to electrically connect the two and thereby set the electricpotential of the charge accumulation region to a certain reset voltage.After that, the transistor is switched off.

When the reset transistor is off, kTC noise is produced. In theconfiguration illustrated as an example in FIG. 1, since the imagingdevice 100 includes the first feedback circuit FCa and the secondfeedback circuit FCb, it is possible to cancel out the kTC noise throughthe formation of the first feedback path and the second feedback path.An operational example during noise cancellation utilizing the firstfeedback circuit FCa and the second feedback circuit FCb will bediscussed later in detail.

In the circuit configuration described with reference to FIG. 1, thefirst feedback circuit FCa and the second feedback circuit FCbrespectively include the first inverting amplifier 50 a and the secondinverting amplifier 50 b, in both of which the non-inverting inputterminal is connected to the reference voltage line 46. For this reason,the formation of the first feedback path and the second feedback pathcauses both the voltage of the first output signal line 30 a and thevoltage of the second output signal line 30 b to converge on thereference voltage VREF. Noise may also be produced during thedissolution of the feedback paths, but as discussed later, the noiseproduced at this time may be considered to be sufficiently small.Consequently, the voltage of the first output signal line 30 a after thedissolution of the feedback path is roughly equal to the referencevoltage VREF, and in addition, the voltage of the second output signalline 30 b after the dissolution of the feedback path also is roughlyequal to the reference voltage VREF. In other words, at this point, thesignal level before performing exposure (hereinafter also called the“dark level”) is roughly equal to the reference voltage VREF.Hereinafter, for the sake of convenience, the series of operations forresetting the electric potential of the charge accumulation region andsilencing noise through feedback may be called the “feedback reset”.

In FIG. 2, the rectangular shaded areas FBr1 and FBr2 diagrammaticallyillustrate periods of feedback reset. In FIG. 2, the rectangular shadedarea EXP diagrammatically illustrates the exposure period. The feedbackreset FBr1 before the exposure period EXP corresponds to the release ofsignal charge from the charge accumulation region, or what is alsocalled the electronic shutter. As illustrated diagrammatically in FIG.2, the feedback reset FBr1 that acts as the electronic shutter isexecuted sequentially row by row. In this example, the feedback resetFBr1 in the pixel cells 10 on the odd-numbered rows is conducted usingthe first feedback circuit FCa. Meanwhile, the feedback reset FBr1 inthe pixel cells 10 on the even-numbered rows is conducted using thesecond feedback circuit FCb.

After the execution of the feedback reset FBr1, exposure is started. Byexposure, signal charge is accumulated in the charge accumulationregion. After the exposure period EXP ends, signal readout is conducted.The image signal obtained at this time has a signal level according tothe luminance. In FIG. 2, the hatched rectangle SR diagrammaticallyillustrates the image signal readout period. As illustrateddiagrammatically in FIG. 2, image signal readout is also executedsequentially row by row. In the case of image signal readout from thepixel cells 10 on the odd-numbered rows, the first switching element S1of the switching circuit 41 and the fourth switching element S4 of theswitching circuit 42 illustrated in FIG. 1 are on. In the case of imagesignal readout from the pixel cells 10 on the even-numbered rows, thesecond switching element S2 of the switching circuit 41 and the fourthswitching element S4 of the switching circuit 42 illustrated in FIG. 1are on. Hereinafter, the period from the image signal readout on acertain row to the image signal readout on the next row may be calledthe 1H period. Herein, since the feedback reset FBr1 is conducted beforeexposure, an image signal with reduced noise influence is obtained.

After image signal readout, the second feedback reset FBr2 is executed.The feedback reset FBr2 is also executed row by row. By the feedbackreset FBr2 the voltage output from the first output signal line 30 a andthe voltage output from the second output signal line 30 b becomesvoltages roughly equal to the reference voltage VREF. In other words,the signal output from the first output signal line 30 a and the signaloutput from the second output signal line 30 b are lowered to a levelsimilar to the dark level.

After the end of the feedback reset FBr2, the output signal is read outin units of rows. The output signal read out at this point is a resetsignal corresponding to the reset level. In FIG. 2, the hatchedrectangle RR diagrammatically illustrates the reset signal readoutperiod. By taking the difference between the image signal read out inthe period SR and the reset signal read out in the period RR, there isobtained a signal from which the influence of fixed-pattern noise havebeen removed.

As described with reference to FIG. 1, in an embodiment of the presentdisclosure, the pair of the first output signal line 30 a and the secondoutput signal line 30 b is provided for each column of the pixel cells10. A part of the pixel cells 10 belonging to the same column (forexample, the pixel cells 10 on the odd-numbered rows) is connected tothe first output signal line 30 a, and another part of the pixel cells10 (for example, the pixel cells 10 on the even-numbered rows) isconnected to the second output signal line 30 b. For this reason, it ispossible to execute in parallel the readout of signals from the pixelcells 10 connected to the first output signal line 30 a, and thefeedback reset for the pixel cells 10 connected to the second outputsignal line 30 b. Because of this, as illustrated diagrammatically inFIG. 2, for example, while signals are being read out on a certain row(the period SR and/or the period RR), a feedback path may be formed onanother certain row, and the electronic shutter (feedback reset FBr1)may be executed. Consequently, it is possible to read out signals forforming the image of one frame faster while also reducing the influenceof noise, and a high frame rate may be realized.

FIG. 3 illustrates, as a comparative example, an imaging device thatincludes a circuit configuration in which all pixel cells belonging tothe same column are connected to a common output signal line. In theimaging device 500 illustrated in FIG. 3, multiple pixel cells 10belonging to the same column are connected to a common output signalline 30. As illustrated, a constant current source 40 and a columncircuit 44 are connected to each output signal line 30 provided incorrespondence with each column of the pixel cells 10. The imagingdevice 500 includes multiple control lines which are connected to avertical scan circuit 51 and which extend in the row direction. Themultiple pixel cells 10 belonging to the same row are connected to thesame control line in common.

The imaging device 500 includes, for each column of the pixel cells 10,a feedback circuit FC that includes an inverting amplifier 50 as part ofitself. The output signal line 30 is connected to one of the inputterminals of the inverting amplifier 50, and a feedback line 52 isconnected to the output terminal. As illustrated, in this example, themultiple pixel cells 10 belonging to the same column are connected tothe common feedback line 52.

In the imaging device 500 of the comparative example, all of themultiple pixel cells 10 having a connection to a certain output signalline 30 are connected to the feedback line 52 corresponding to thatoutput signal line 30. For this reason, when forming a feedback path fora certain pixel cell 10, signals cannot be read out in parallel from theother pixel cells 10 belonging to the same column. Consequently, asillustrated in FIG. 2, on the same column, the period from the start ofthe period SR until the end of the period RR on a certain row and theperiod of the electronic shutter (feedback reset FBr1) on another rowcannot be made to overlap. In other words, unless the series ofoperations from the start of the period SR until the end of the periodRR on a certain row has finished, the electronic shutter on another rowon the same column cannot be started. In other words, in a configurationthat disposes one each of the output signal line 30 and the feedbackline 52 for each column of the pixel cells 10, the frame rate isconstrained by the period needed for noise cancelling (typically severalmicroseconds). In contrast, according to the configuration illustratedas an example in FIG. 1, it is possible to start the electronic shutteron another row on the same column, without waiting for the series ofoperations from the start of the period SR until the end of the periodRR on a certain row to finish.

FIG. 4 illustrates in further detail the drive timings of pixel cells onrespective rows of the pixel cells 10 in the imaging device 100. FIG. 4is an example of operations in the case of extracting digital imagedata. Note that in FIG. 4, to avoid complexity, the feedback reset FBr1before the exposure period EXP is not illustrated on the first row andthe second row.

In the configuration illustrated as an example in FIG. 1, the columncircuit 44 may include an integrating AD converter, for example. In thiscase, a period for converting the voltage input into the column circuit44 to a digital output may be necessary. In FIG. 4, the hatchedrectangle DC diagrammatically illustrates the period taken for ADconversion of the image signal (downcount), while the hatched rectangleUC diagrammatically illustrates the period taken for AD conversion ofthe reset signal (upcount). In typical operation as described withreference to FIG. 2, the difference between the image signal read out inthe period SR and the reset signal read out in the period RR is acquiredas the signal for forming an image, and thus the influence ofcharacteristic variation of the respective column circuits 44 iscancelled out.

In the example illustrated in FIG. 4, the period from the start of theperiod SR until the end of the period UC may be designated the 1Hperiod. As illustrated in FIG. 4, according to the configurationillustrated as an example in FIG. 1, the period from the start of theperiod SR until the end of the period UC on a certain row and the periodof the electronic shutter (feedback reset FBr1) on another row may bemade to overlap.

(Example of Circuit Configuration of Pixel Cell 10)

FIG. 5 illustrates an example of the circuit configuration of the pixelcell 10. As illustrated in FIG. 5, each pixel cell 10 includes aphotoelectric converter 11 that generates an electric signal in responseto the radiation of light, and a signal detection circuit SC.Hereinafter, an imaging device having a laminated structure isillustrated as an example. In other words, a laminated structure of apixel electrode 11 x, a photoelectric conversion layer 11 y, and anoptically transparent counter electrode 11 z is illustrated as anexample of the photoelectric converter 11. Obviously, it is alsopossible to use a photodiode as the photoelectric converter 11.

The signal detection circuit SC includes a signal detection transistor12. In this example, the signal detection circuit SC additionallyincludes an address transistor 14. As illustrated, the addresstransistor 14 is connected between the signal detection transistor 12and a corresponding output signal line (the first output signal line 30a or the second output signal line 30 b). The gate of the addresstransistor 14 is connected to an address control line (not illustrated)having a connection to a vertical scan circuit (not illustrated), andduring operation of the imaging device 100, the address control signalSEL is applied. The vertical scan circuit, by controlling the switchingon and off of the address transistor 14 via the address control line, isable to read out the output of the signal detection transistor 12 of aselected pixel cell 10 to the corresponding output signal line.

Typically, the signal detection transistor 12 and the address transistor14 are FETs formed on a semiconductor substrate. Hereinafter, n-channelMOSFETs are illustrated as an example of the transistors. Note that thesemiconductor substrate is not limited to being a substrate that is asemiconductor in entirety. The semiconductor substrate may also be asubstrate such as an insulating substrate provided with a semiconductorlayer on the surface of the side on which the imaging area is formed. Ontop of the semiconductor substrate on which the signal detectiontransistor 12 and the address transistor 14 are formed, an insulatinglayer covering these transistors may be disposed.

The photoelectric converter 11 includes the pixel electrode 11 x, thecounter electrode 11 z, and the photoelectric conversion layer 11 ydisposed between the two. The pixel electrode 11 x is provided for eachpixel cell 10 on an insulating layer provided on the semiconductorsubstrate, so as to be separated electrically from the pixel electrodes11 x of other adjacent pixel cells 10. The pixel electrode 11 x isformed from a material such as a metal like aluminum or copper, metalnitride, or polysilicon that has been given electrical conductivity bybeing doped with impurities.

The photoelectric conversion layer 11 y is formed from an organicmaterial, or an inorganic material such as amorphous silicon, andreceives light incident through the counter electrode 11 z to generatepositive and negative electric charges (a hole-electron pair). One ofthe positive and negative electric charges generated by photoelectricconversion may be used as a signal charge. Hereinafter, the use of thehole as the signal charge will be illustrated as an example. Typically,the photoelectric conversion layer 11 y is formed so as to extend overmultiple pixel cells 10. The photoelectric conversion layer 11 y mayalso include a layer made of an organic material and a layer made of aninorganic material.

The counter electrode 11 z is formed from a transparent conductivematerial such as ITO, and is disposed on the light incident side of thephotoelectric conversion layer 11 y. Typically, the counter electrode 11z is formed so as to extend over the multiple pixel cells 10, similarlyto the photoelectric conversion layer 11 y. During operation of theimaging device 100, a bias voltage of approximately 10 V, for example,is applied to the counter electrode 11 z. By using the bias voltage toraise the electric potential of the counter electrode 11 z higher thanthe electric potential of the pixel electrode 11 x, the positiveelectric charges to be used as signal charges (holes, for example)generated by photoelectric conversion may be collected by the pixelelectrode 11 x.

The pixel electrode 11 x is electrically connected to the gate of thesignal detection transistor 12. Hereinafter, the node FD between thepixel electrode 11 x and the gate of the signal detection transistor 12may be called the “charge accumulation node FD”. The signal chargescollected by the pixel electrode 11 x are accumulated in a chargeaccumulation region that includes the charge accumulation node FD aspart of itself. As illustrated, one of the source and the drain (herein,the drain) of the signal detection transistor 12 is connected to a powersupply line to which a power supply voltage VDD is applied duringoperation of the imaging device 100 (source follower power supply), andthe signal detection transistor 12 amplifies and outputs an electricalsignal generated by the photoelectric converter 11.

In the configuration illustrated as an example in FIG. 5, one of thesource and the drain of the signal detection circuit SC is connected tothe charge accumulation node FD, while the other of the source and thedrain includes a reset transistor 16 connected to a correspondingfeedback line (the first feedback line 52 a or the second feedback line52 b). The gate of the reset transistor 16 is connected to a resetcontrol line (not illustrated), and during operation of the imagingdevice 100, a reset control signal RST is applied via the reset controlline. The reset control line is connected to a vertical scan circuit(not illustrated), for example. The vertical scan circuit, by switchingon the reset transistor 16 via the reset control line, is able to resetthe electric potential of the charge accumulation node FD of theselected pixel cell 10. In this example, switching on the resettransistor 16 causes the voltage of the corresponding feedback line tobe applied to the charge accumulation node FD.

In the example illustrated in FIG. 5, the signal detection circuit SCadditionally includes a first capacitive element 21, a second capacitiveelement 22, and a feedback transistor 18. The first capacitive element21 is connected between the charge accumulation node FD and one of thesource and the drain of the feedback transistor 18. In other words, oneof the source and the drain of the feedback transistor 18 iselectrically connected to the pixel electrode 11 x of the photoelectricconverter 11 via the first capacitive element 21. The other of thesource and the drain of the feedback transistor 18 is connected to thecorresponding feedback line (the first feedback line 52 a or the secondfeedback line 52 b). Hereinafter, the node between the feedbacktransistor 18 and the first capacitive element 21 may be called the“reset drain node RD”.

The gate of the feedback transistor 18 is connected to a feedbackcontrol line (not illustrated), and during operation of the imagingdevice 100, a feedback control signal FB is applied via the feedbackcontrol line. The feedback control line is connected to a vertical scancircuit (not illustrated), for example. The vertical scan circuittoggles the feedback transistor 18 on and off via the feedback controlline.

If the feedback transistor 18 is switched on while the addresstransistor 14 is in the on state, a feedback path is formed includingthe signal detection transistor 12 of the selected pixel cell 10 as partof itself. In the illustrated example, switching on the addresstransistor 14 and the feedback transistor 18 of the pixel cell 10 i,j onthe (i)th row, for example, causes the formation of a first feedbackpath including the signal detection transistor 12 of the pixel cell 10_(i,j) as part of itself. If the address transistor 14 and the feedbacktransistor 18 of the pixel cell 10 _(i+1,j) on the (i+1)th row areswitched on, there is formed a second feedback path including the signaldetection transistor 12 of the pixel cell 10 _(i+1,j) as part of itself.In this way, the first feedback circuit FCa may be considered to be acircuit that includes the signal detection transistor 12 of a pixel cell10 having a connection to the first output signal line 30 a as part ofthe first feedback path. Also, the second feedback circuit FCb may beconsidered to be a circuit that includes the signal detection transistor12 of a pixel cell 10 having a connection to the second output signalline 30 b as part of the second feedback path.

During the formation of the first feedback path, the first feedbackcircuit FCa negatively feeds back the output of the signal detectiontransistor 12 in the pixel cell 10 having a connection to the firstoutput signal line 30 a to one of the source and the drain of thefeedback transistor 18, the one not being connected to the reset drainnode RD. During the formation of the second feedback path, the secondfeedback circuit FCb negatively feeds back the output of the signaldetection transistor 12 in the pixel cell 10 having a connection to thesecond output signal line 30 b to one of the source and the drain of thefeedback transistor 18, the one not being connected to the reset drainnode RD.

The second capacitive element 22 is a capacitive element having a largercapacitance value than the first capacitive element. One electrode ofthe second capacitive element 22 is connected to the reset drain nodeRD. During operation of the imaging device 100, a certain voltage VR (0V, for example) is applied to the other electrode of the secondcapacitive element 22. During operation of the imaging device 100, thevoltage VR may be a fixed voltage, or a pulse voltage, for example.

A capacitance circuit including a series connection of the firstcapacitive element 21 and the second capacitive element 22 is providedbetween the charge accumulation node FD and the reference potential VR.In addition, the signal detection circuit SC includes the resettransistor 16 that controls the supply of the reset voltage to thecharge accumulation node FD and the feedback transistor 18 that controlsthe formation of a feedback path. Thus, kTC noise may be reduced moreeffectively.

An example of the control of each transistor and each switching elementin the first operational example discussed above will now be describedin further detail with reference to FIG. 6.

FIG. 6 illustrates a typical example of the changes in the controlsignals for each transistor and each switching element in theoperational example described with reference to FIG. 4. Herein, anexample of operation in the pixel cell 101 _(1,j) on the 1st row, (j)thcolumn and the pixel cell 10 _(k,k) on the kth row, (j)th column of thepixel array PA will be described. Herein, the kth row is one of theeven-numbered rows.

In FIG. 6, the graphs of SELi and SELk represent changes in the addresscontrol signal SEL on the 1st row and the kth row, respectively.Similarly, the graphs of RSTi and RSTk represent changes in the resetcontrol signal RST on the 1st row and the kth row, respectively, and thegraphs of FB₁ and FB_(k) represent changes in the feedback controlsignal FB on the 1st row and the kth row, respectively. The graphs of φ1to φ4 represent changes in the control signals of the first switchingelement S1 to the fourth switching element S4, respectively. Herein, thefirst switching element 51 So the fourth switching element S4 are alltaken to be switched on when the control signal is at the high level. InFIG. 6, approximate changes in the input voltage VIN_(j) for the columncircuit 44 _(j), as well as the driving sequences illustrated in FIG. 4in relation to the 1st row and the kth row, are also illustrated.

In the example illustrated in FIG. 6, first, the control signals φ1 andφ4 are switched to the high level. At this point, the column circuit 44_(j) enters a state of being connected to the first output signal line30 a _(j), and the voltage VSIGa_(j) of the first output signal line 30a _(j) is input into the column circuit 44 _(j) as VIN_(j). In thisexample, the address control signal SEL₁ is taken to be at the highlevel. Consequently, the voltage VSIGa_(j) of the first output signalline 30 a _(j) is a voltage corresponding to the amount of signal chargeaccumulated in the charge accumulation node FD of the pixel cell 10_(1,j) in the exposure period. In other words, an image signal of thepixel cell 10 _(1,j) is read out by the column circuit 44 _(j). Asillustrated, after reading out the image signal, the feedback reset FBr2and the reset signal readout are executed for the pixel cell 10 _(1,j).

At this point, focusing on the kth row, the feedback reset FBr1 isexecuted as an electronic shutter on the kth row. Typically, controllike the following is executed on each transistor of the pixel cells 10on the kth row.

In the feedback reset FBr1, the address control signal SEL_(k) on thekth row is set to the high level, and the address transistor 14 of thepixel cell 10 _(k,j) is switched on. By switching on the addresstransistor 14, the output voltage of the signal detection transistor 12of the pixel cell 10 _(k,j) is applied to the second output signal line30 b _(j).

In the state with the address control signal SEL_(k) at the high level,suppose that the reset control signal RST_(k) and the feedback controlsignal FB_(k) are at the high level. The reset control signal RST_(k)being at the high level causes the reset transistor 16 of the pixel cell10 _(k,j) to switch on, and through the reset transistor 16, the secondfeedback line 52 b _(j) is electrically connected to the chargeaccumulation node FD of the pixel cell 10 k,j. Consequently, the voltageof the second feedback line 52 b _(j) is supplied to the chargeaccumulation node FD of the pixel cell 10 _(k,j), and the voltage of thecharge accumulation node FD is reset to a voltage at which the voltageof the second output signal line 30 b _(j) becomes the reference voltageVREF.

Next, by setting the reset control signal RSTk to the low level, thereset transistor 16 of the pixel cell 10 _(k,j) is switched off. As thereset transistor 16 switches off, kTC noise is produced. However, whenthe reset transistor 16 switches off, the feedback transistor 18 isstill on, thus maintaining the state in which the second feedback paththat negatively feeds back the output of the signal detection transistor12 is formed. For this reason, provided that A is the gain of the secondfeedback circuit FCb_(j), the kTC noise produced by the switching off ofthe reset transistor 16 is cancelled up to a magnitude of 1/(1+A).

Next, by setting the feedback control signal FB_(k) to the low level,the feedback transistor 18 of the pixel cell 10 _(k,j) is switched off.As the feedback transistor 18 switches off, kTC noise is produced.However, herein, the signal detection circuit SC includes the firstcapacitive element 21 and the second capacitive element 22, as describedwith reference to FIG. 5. For this reason, the magnitude of the kTCnoise imparted to the voltage of the charge accumulation node FD by theswitching off of the feedback transistor 18 may be suppressed by afactor of (Cfd/C2)^(1/2)×(C1/(C1+Cfd)) for the case of directlyconnecting the feedback transistor 18 to the charge accumulation node FDwithout providing the first capacitive element 21 and the secondcapacitive element 22 in the signal detection circuit SC. In this way,by providing the first capacitive element 21 and the second capacitiveelement 22 in the signal detection circuit SC, it is possible to furtherreduce the magnitude of the kTC noise imparted to the voltage of thecharge accumulation node FD. Note that in the above mathematicalexpression, Cfd, C1, and C2 represent the capacitance of the chargeaccumulation node FD, the capacitance of the first capacitive element21, and the capacitance of the second capacitive element 22,respectively, and “x” denotes multiplication.

By the feedback reset FBr1, the voltage VSIGb_(j) of the second outputsignal line 30 b _(j) becomes a voltage level nearly equal to thereference voltage VREF. As in this example, when noise cancellationstarts, that is, when the reset transistor 16 switches off, the voltageof the output signal line (herein, the second output signal line 30 b_(j)) is made to approach the reference voltage VREF that acts as apost-noise cancellation target voltage. Thus, it is possible to cancelthe kTC noise in a comparatively short time. After the feedback resetFBr1 ends, the address transistor 14 is switched off, and the exposure(accumulation of signal charge) of the kth row starts.

As illustrated in the lower part of FIG. 6, in this example, in parallelwith the feedback reset FBr1 of the kth row, the image signal readout,the feedback reset FBr2 (the feedback reset after exposure), and thereset signal readout from the pixel cell 10 _(1,j) on the 1st row areexecuted. In an embodiment of the present disclosure, such parallelcontrol is possible because the output signal line that accepts theoutput of the pixel cell 10 _(k,j) (the second output signal line 30 b_(j)) and the output signal line that accepts the output of the pixelcell 10 _(1,j) (the first output signal line 30 a _(j)) are separatesignal lines. Hereinafter, a typical example of control during imagesignal and reset signal readout will be described. Since the signalreadout operation itself is shared in common among the respective rows,herein, control during the signal readout on the kth row will bedescribed.

The respective graphs on the right side of FIG. 6 will be referenced. Asillustrated, when reading out a signal from the kth row, the controlssignals φ1 and φ2 are changed to low level and high level, respectively.As a result, the column circuit 44 _(j) enters a state of beingconnected to the second output signal line 30 b _(j), and the voltageVSIGb_(j) of the second output signal line 30 b _(j) is input into thecolumn circuit 44 _(j) as VIN_(j).

After connecting the column circuit 44 _(j) and the second output signalline 30 b _(j), the address control signal SEL_(k) of the kth row is setto the high level, thereby causing the address transistor 14 of thepixel cell 10 _(k,j) to switch on. As a result of the address transistor14 switching on, the voltage VSIGb_(j) of the second output signal line30 b _(j) changes to a voltage corresponding to the amount of signalcharge accumulated in the charge accumulation node FD in the exposureperiod. In other words, the column circuit 44 _(j) receives an imagesignal from the pixel cell 10 _(k,j) via the second output signal line30 b _(j). At this point, the voltage level of the voltage value VSL isacquired as the image signal from the pixel cell 10 _(k,j).

After acquisition of the image signal, the feedback reset FBr2 isexecuted. As FIG. 6 demonstrates, the control of each transistor in thefeedback reset FBr2 may be mostly similar to the feedback reset FBr1.

After the end of the feedback reset FBr2, the readout of the resetsignal from the pixel cell 10 _(k,j) is executed. Specifically, afterthe reset transistor 16 is switched off, the voltage level of the secondoutput signal line 30 bj is acquired at a time (typically immediatelyafter the feedback transistor 18 is switched off) after the elapse of atime preset as a noise cancellation period. Similarly to the case of thefeedback reset FBr1, by the feedback reset FBr2, the input voltageVIN_(j) into the column circuit 44 _(j) changes to a voltage levelnearly equal to the reference voltage VREF. Consequently, a voltagelevel of the voltage value V_(RF) that is nearly equal to the referencevoltage VREF is acquired as the reset signal.

By taking the difference between the image signal and the reset signal,there is obtained a signal from which fixed-pattern noise has beenremoved. In other words, the difference between the voltage level of thevoltage value V_(SL) and the voltage level of the voltage value V_(RF)is the signal S used for image formation. In this way, there is obtaineda signal from which kTC noise and fixed-pattern noise have been removed.

(Second Operational Example in Imaging Device 100)

In many cases, the feedback resets FBr1 and FBr2 discussed above take along time compared to signal readout. The inventors investigated ways ofachieving even higher frame rates, and discovered that the feedbackreset FBr2 for obtaining the reset signal may be omitted.

FIG. 7 is a conceptual diagram illustrating another example ofoperations in the imaging device 100. FIG. 8 illustrates in furtherdetail the drive timings on respective rows of pixel cells 10, in thecase of applying the second operational example outlined in FIG. 7 tothe acquisition of digital image data. For example, as a comparisonbetween FIG. 7 and FIG. 2 demonstrates, in the second operationalexample described herein, the feedback reset FBr1 is executed as anelectronic shutter for each row of the pixel array PA, whereas thesecond feedback reset FBr2 following the exposure period EXP for the rowtargeted for signal readout is omitted. For each row, by reducing thenumber of feedback resets that take a long time compared to signalreadout, the 1H period may be shortened further. Consequently, evenhigher frame rates may be achieved.

FIG. 9 illustrates a typical example of the changes in the controlsignals for each transistor and each switching element in the secondoperational example outlined in FIG. 7. First, the respective graphs onthe left side of FIG. 9 will be referenced. In this example, the readoutof the image signal and the readout of the reset signal on the 1st roware executed while the feedback reset FBr1 (electronic shutter) is beingexecuted on the kth row. The control of the address control signalSEL_(k), the reset control signal RST_(k), and the feedback controlsignal FB_(k) on the kth row in the feedback reset FBr1 of the kth rowis similar to the control described with reference to FIG. 6, anddescription thereof will be omitted.

As discussed earlier, the signal readout operation itself is shared incommon among the respective rows. Consequently, instead of the operationof reading out a signal from the 1st row, the operation of reading out asignal from the kth row will be described with reference to therespective graphs on the right side of FIG. 9. Note that in thisexample, when reading out a signal from the kth row, the address controlsignal SEL₁, the reset control signal RST₁, and the feedback controlsignal FB₁ of the 1st row are all set to the low level, and the 1st rowis in a state in which exposure is being executed, for example.

When reading out an image signal from the kth row, first, the controlsignals φ2 and φ4 are set to the high level. As a result, the columncircuit 44 _(j) becomes connected to the second output signal line 30 b_(j). Also, the address control signal SEL_(k) of the kth row is set tothe high level, thereby causing the address transistor 14 of the pixelcell 10 _(k,j) to switch on. Consequently, the voltage VSIGb_(j) of thesecond output signal line 30 b _(j) changes to the output voltage of thesignal detection transistor 12 of the pixel cell 10 _(k,j), or in otherwords, a voltage corresponding to the signal charge accumulated in thecharge accumulation node FD of the pixel cell 10 _(k,j) (herein, avoltage value VSL). As a result, the output voltage of the pixel cell 10_(k,j) is applied to the column circuit 44 _(j). In other words, thecolumn circuit 44 _(j) acquires an image signal from the pixel cell 10_(k,j) (herein, the voltage value V_(SL)).

After acquisition of the image signal, the control signals φ4 and φ3 areswithed to low level and high level, respectively. As a result, aconnection is established between the reference voltage line 46 and thecolumn circuit 44 _(j), and the reference voltage VREF is applied to thecolumn circuit 44 _(j). The column circuit 44 _(j) acquires thisreference voltage VREF as the reset signal. In other words, in thesecond operational example, the difference between the voltage acquiredin the period SR (voltage value: V_(SL)) and the reference voltage VREFacquired in the period RR is acquired as the signal S used for imageformation.

In the first operational example discussed earlier, for each pixel cell10, the voltage value V_(RF), which is acquired after executing thefeedback reset FBr2 and which is nearly equal to the reference voltageVREF, is used as the voltage level of the reset signal. This is becausethe voltage level after executing the feedback reset FBr2 may be used asthe dark level. As described already, the voltage level in the case ofexecuting the feedback reset FBr1 as an electronic shutter is roughlyequal to the reference voltage VREF, and in addition, the voltage levelafter executing the feedback reset FBr2 may be considered nearly equalto the reference voltage VREF. For this reason, the voltage level afterexecuting the feedback reset FBr2 may also be treated as the dark level.By acquiring the voltage level after executing the feedback reset FBr2for each pixel cell 10, and using that voltage level as the dark levelfor each pixel cell 10, fixed-pattern noise arising from variationsamong the pixel cells 10 and also among columns of the pixel cells 10may be removed. The causes of such fixed-pattern noise may be, forexample, variations in the threshold voltage (Vth) in the signaldetection transistor 12 for each pixel cell 10, variations in themagnitude of the constant current on each output signal line (or inother words, each column), and variations in the load on each outputsignal line (such as interconnect resistance and parasitic capacitance).

In contrast, in the second operational example, the reference voltageVREF itself is utilized as the reset level. From the reasons givenabove, the dark level in each pixel cell 10 is nearly equal to thevoltage level of the reference voltage VREF. Consequently, it ispossible to use the reference voltage VREF as a standard dark levelshared in common among all pixels.

On the other hand, if the reference voltage VREF is treated as a commonstandard voltage level, it is difficult to completely remove thefixed-pattern noise discussed above by subtracting the reference voltageVREF from the voltage V_(SL)that acts as the image signal. However, thefixed-pattern noise discussed earlier may be removed relatively easily.For example, variations in the signal level among columns of the pixelcells 10 may be acquired in the break period of the frame scan (alsocalled the blanking interval), and information about the variationsamong the columns may be held in memory. By subtracting variations foreach column from the acquired image data based on the information aboutthe variations among the columns, the fixed-pattern noise arising fromthe variations among the columns may be removed. Alternatively, a darklevel accounting for the variations among the pixel cells 10 and alsoamong the columns of the pixel cells 10 may be acquired in advance andheld in memory external to the imaging device 100. For example, bysubtracting the dark level held in external memory from the output ofthe imaging device 100 in a circuit external to the imaging device 100,it is still similarly possible to reduce the influence of fixed-patternnoise. If the output of a signal with residual fixed-pattern noise toequipment external to the imaging device 100 is allowed, the step ofremoving fixed-pattern noise in the imaging device 100 may also beomitted.

In this way, by using the voltage level of the reference voltage VREF asthe dark level, it is possible to quickly acquire a signal S withreduced noise influence similarly to the first operational example,while also omitting the feedback reset FBr2. According to the secondoperational example, the frame rate may be improved even furthercompared to the first operational example.

Additionally, since the feedback reset between the acquisition of theimage signal and the acquisition of the reset signal is omitted, thesecond operational example is advantageous compared to the firstoperational example from the perspective of kTC noise reduction. Forexample, suppose that N is the amount of noise remaining after a singlefeedback reset, and in addition, assume that the remaining amount ofnoise is shared in common between the feedback resets FBr1 and FBr2. Inthis case, the total amount of noise when executing two feedback resetsis expressed as (N²+N²)^(1/2)=2^(1/2)N. In other words, by setting thenumber of feedback resets to one, the total amount of noise may bereduced by a factor of (½)^(1/2) compared to executing two feedbackresets.

Like the circuit configuration illustrated as an example in FIG. 1, aconfiguration enabling use of the switching circuit 42 to selectivelyapply the voltage of the reference voltage line 46 to the column circuit44 is adopted, for example. Thus, both lower noise and improved framerates may be achieved. Additionally, a configuration that connects thereference voltage line 46 to the input terminal of the invertingamplifiers 50 (first inverting amplifier 50 a and second invertingamplifier 50 b) to enable supply of the reference voltage to theinverting amplifier 50 and the column circuit 44 is adopted. Thus, thevoltage level of the reference voltage may be used as the dark level.According to an embodiment of the present disclosure, the signal levelbefore performing exposure and the voltage level of the referencevoltage are nearly the same. Accordingly, almost no reduction in dynamicrange occurs, even when using the difference between the voltage levelof the image signal and the voltage of the reference signal rather thanthe dark level.

Note that the exposure period EXP may also be started again followingthe period RR, without executing the electronic shutter. For example, inthe example illustrated in FIG. 9, the exposure period EXP may bestarted again following the period RR on the kth row. In the firstoperational example, since the second feedback reset FBr2 is executedevery time an image signal is acquired, the output of the output signalline after acquisition of the image signal drops to a voltage levelclose to the dark level. In contrast, in the second operational example,since the second feedback reset FBr2 is not executed, even though theinput voltage VIN_(j) for the column circuit 44 _(j) after acquisitionof the reset signal falls to the reference voltage VREF, the value ofthe voltage (herein, VSIGb_(j)) on the output signal line (herein, thesecond output signal line 30 b _(j)) is still maintained at V_(SL). Inother words, by starting the exposure period EXP again following theperiod RR, further accumulation of signal charge is possible withoutdestroying the information obtained from the previous exposure. In otherwords, by applying the second operational example, non-destructivereadout is possible.

(Third Operational Example in Imaging Device 100)

Depending on the situation in which the imaging device is used, it maybe beneficial to prioritize shooting at a high frame rate rather thanreducing noise. For example, in situations where fast sampling isdemanded, such as applications for detecting objects moving at highspeeds, fixed-pattern noise does not pose a major problem.Alternatively, in cases such as capturing images of the night sky inwhich the exposure time is a long time, such as in units of several tensof minutes or several hours, it is beneficial to obtain intermediatesensing data for deciding an appropriate amount of exposure.

FIG. 10 is a conceptual diagram illustrating yet another example ofoperations in the imaging device 100. FIG. 11 illustrates in furtherdetail the drive timings on respective rows of pixel cells 10, in thecase of applying the third operational example outlined in FIG. 10 tothe acquisition of digital image data. In the third operational exampledescribed herein, on each row of the pixel array PA, the feedback resetFBr1 is executed as an electronic shutter at the beginning of shooting(not illustrated in FIG. 11), and after that, exposure and image signalreadout are executed several times. Also, as a comparison of FIG. 11 andFIG. 8 demonstrates, for example, driving is executed so that the periodUC for AD conversion of the reset signal on a certain row overlaps withthe image signal readout period SR on the next row. Consequently, aneven shorter 1H period may be achieved.

FIG. 12 illustrates a typical example of the changes in the controlsignals for each transistor and each switching element in the thirdoperational example outlined in FIG. 10. The respective graphs on theright side of FIG. 12 illustrate an example of the changes in eachcontrol signal when reading out a signal from the kth row. The specificcontrol in this example is similar to the control described withreference to FIG. 9.

As illustrated on the right side of FIG. 12, non-destructive readout isalso possible in the third operational example. In the third operationalexample, the feedback reset FBr1 is executed as an electronic shutterwhen exposure is started, several exposure periods are provided over acertain period, and image signal readout is executed for each exposureperiod. Based on each of the obtained image signals, it is possible toconstruct multiple images corresponding to the multiple readouts. Sincethe image signal readout is non-destructive, there is obtained a groupof successive images in which brightness increases in a time series.This group of images may be utilized as sensing images. For example, byacquiring a group of successive images in a certain period, it ispossible to detect an object moving at high speed based on the data ofthese images. Alternatively, an optimal exposure time may be decidedfrom the brightness changes in the group of successive images.

The third operational example is applicable to usages such as fastautofocus and the sensing of moving objects. Note that since thefeedback reset FBr1 is executed at the beginning of shooting, it ispossible to obtain sensing images in which the influence of kTC noisehas been reduced. Note that a reference-signal generator according tothe present disclosure is exemplified by the voltage supply circuit 48in the present embodiment.

Second Embodiment

FIG. 13 illustrates an overview of an exemplary circuit configuration ofan imaging device according to a second embodiment of the presentdisclosure. In FIG. 13, among the multiple pixel cells 10 included inthe pixel array PA, the two representative pixel cells 10 _(i,j) and 10_(i+1,j) belonging to the (j)th column are illustrated. The majordifference between the imaging device 200 illustrated in FIG. 13 and theimaging device 100 described with reference to FIG. 1 is that theimaging device 100 includes the first inverting amplifier 50 a and thesecond inverting amplifier 50 b in correspondence with the first outputsignal line 30 a and the second output signal line 30 b, whereas in theimaging device 200, a single inverting amplifier 50 is provided for eachcolumn. Also, the imaging device 200 includes a third switching circuit43 connected between the pair of the first output signal line 30 a andthe second output signal line 30 b, and the inverting amplifier 50.

In common with the first embodiment, the pixel cells 10 on odd-numberedrows (or even-numbered rows) in the pixel array PA are connected to thefirst output signal line 30 a, while the pixel cells 10 on theeven-numbered rows (or odd-numbered rows) are connected to the secondoutput signal line 30 b. As illustrated, herein, the first output signalline 30 a and the second output signal line 30 b are connected to theswitching circuit 41 and the switching circuit 43.

In the configuration illustrated as an example in FIG. 13, the switchingcircuit 43 includes a fifth switching element S5 to an eighth switchingelement S8. The fifth switching element S5 is connected between thefirst output signal line 30 a and the inverting input terminal of theinverting amplifier 50, while the sixth switching element S6 isconnected between the second output signal line 30 b and the invertinginput terminal of the inverting amplifier 50. The seventh switchingelement S7 is connected between the output terminal of the invertingamplifier 50 and the first feedback line 52 a, while the eighthswitching element S8 is connected between the output terminal of theinverting amplifier 50 and the second feedback line 52 b. The fifthswitching element S5 to the eighth switching element S8 are FETs, forexample. The reference voltage line 46 is connected to the non-invertinginput terminal of the inverting amplifier 50, similarly to the imagingdevice 100.

The fifth switching element S5 and the sixth switching element S6 arecontrolled to operate in a complementary manner. The seventh switchingelement S7 and the eighth switching element S8 are controlled to operatein a complementary manner. Also, the switching circuit 43 is controlledso that when the fifth switching element S5 is on, the seventh switchingelement S7 is on, and when the sixth switching element S6 is on, theeighth switching element S8 is on. When the fifth switching element S5and the seventh switching element S7 are on, there is formed a firstfeedback path that includes the inverting amplifier 50 _(j) as part ofthe path, and negatively feeds back the output of the pixel cell 10_(i,j). On the other hand, when the sixth switching element S6 and theeighth switching element S8 are on, there is formed a second feedbackpath that includes the inverting amplifier 50 _(j) as part of the path,and negatively feeds back the output of the pixel cell 10 _(i+1,j).

In the second embodiment, the first feedback circuit FCa and the secondfeedback circuit FCb share the inverting amplifier 50. For this reason,the configuration illustrated as an example in FIG. 13 is unsuited tocontrol in which the feedback reset FBr1 and the feedback reset FBr2 areexecuted in parallel between different rows on the same column asillustrated in FIG. 4. However, similarly to the first embodiment, it ispossible to apply control similar to the second and third operationalexamples discussed earlier. Consequently, fast readout of low-noisesignals is possible. Additionally, non-destructive readout is alsopossible. Furthermore, in the second embodiment, since the firstfeedback circuit FCa and the second feedback circuit FCb share theinverting amplifier 50, it is not necessary to provide two invertingamplifiers for each column of the multiple pixel cells 10. Consequently,from the perspective of reducing power consumption and/or the surfacearea of the pixel cells, the second embodiment is advantageous over thefirst embodiment.

FIG. 14 illustrates a typical example of the changes in the controlsignals for each transistor and each switching element, in the case ofapplying the second operational example outlined in FIG. 7 to theimaging device 200. In FIG. 14, the graphs of φ5 to φ8 represent changesin the control signals of the fifth switching element S5 to the eighthswitching element S8 in the switching circuit 43, respectively. Herein,the fifth switching element S5 to the eighth switching element S8 areall taken to be switched on when the control signal is at the highlevel.

The respective graphs on the left side of FIG. 14 will be referenced. Inthis example, in the image signal readout period SR and the reset signalreadout period RR for reading out signals from the pixel cell 10 _(1,j)on the 1st row, the control signals φ6 and the φ8 are set to the highlevel. By setting the control signals φ6 and φ8 to the high level, thesecond feedback circuit is formed. Consequently, as illustrated in FIG.14, in parallel with the readout of signals from the pixel cell 10_(1,j) on the 1st row, the feedback reset FBr1 may be executed as anelectronic shutter for the pixel cell 10 _(k,j) on the kth row.

Next, the respective graphs on the right side of FIG. 14 will bereferenced. Herein, the formation of the second feedback circuit isdissolved by switching the control signals φ6 and φ8 to the low level.In this state, setting the address control signal SEL_(k), the controlsignal φ2, and the control signal φ4 to the high level causes anelectrical connection to be established between the second output signalline 30 b _(j) and the column circuit 44 _(j), and an image signal maybe read out from the pixel cell 10 _(k,j) on the kth row. In thisexample, the reference voltage VREF likewise is acquired as the resetsignal. By subtracting the reference voltage VREF acquired in the periodRR from the voltage acquired in the period SR (voltage value: V_(SL)),the signal S used for image formation may be acquired.

As the graph of VSIGb_(j) demonstrates, in the second embodiment,non-destructive readout likewise is possible. Even in the case ofapplying the third operational example, it is sufficient to executecontrol mostly similar to the first embodiment on each transistor andeach switching element.

Ehird embodiment

FIG. 15 illustrates an overview of an exemplary circuit configuration ofan imaging device according to a third embodiment of the presentdisclosure. The pixel array PA in the imaging device 300 illustrated inFIG. 15 includes multiple pixel cells 20 arrayed in a matrix. In FIG.15, among the multiple pixel cells 20 included in the pixel array PA,the two representative pixel cells 20 _(i,j) and 20 _(i+1,j) belongingto the (j)th column are illustrated. The major differences between theimaging device 300 and the imaging device 100 described with referenceto FIG. 1 as well as the imaging device 200 described with reference toFIG. 13 are that the first feedback circuit FCc in the imaging device300 does not include the first inverting amplifier 50 a _(j) providedfor each column of the multiple pixel cells 20 in correspondence withthe first output signal line 30 a _(j), and in addition, the secondfeedback circuit FCd in the imaging device 300 does not include thesecond inverting amplifier 50 bj provided for each column of themultiple pixel cells 20 in correspondence with the second output signalline 30 b _(j). In the imaging device 300, the first feedback path andthe second feedback path are formed inside the pixel cells 20 _(i,j) and20 _(i+1,j), respectively.

In the configuration illustrated as an example in FIG. 15, the source ofthe signal detection transistor 12 in each pixel cell 20 is connected tothe drain of the address transistor 14. The source of the addresstransistor 14 is connected to the corresponding output signal line (thefirst output signal line 30 a or the second output signal line 30 b). Inthe illustrated example, the source of the address transistor 14 in thepixel cell 20 _(i,j) on the (i)th row is connected to the first outputsignal line 30 a _(j), while the source of the address transistor 14 inthe pixel cell 20 _(1+1,j) on the (i+1)th row is connected to the secondoutput signal line 30 b _(j).

Herein, one end of the first output signal line 30 a _(j) and the secondoutput signal line 30 b _(j) is connected to switching circuits 44 a_(j) and 44 b _(j), respectively. The switching circuit 44 a _(j)connected to the first output signal line 30 a _(j) includes a switchingelement Sol connected between a constant current source 41 a _(j) andthe first output signal line 30 a _(j), and a switching element Se2connected between a constant current source 42 a _(j) and the firstoutput signal line 30 a _(j). The switching circuit 44 b _(j) connectedto the second output signal line 30 b _(j) includes a switching elementSet connected between a constant current source 41 b _(j) and the secondoutput signal line 30 b _(j), and a switching element Se2 connectedbetween a constant current source 42 b _(j) and the second output signalline 30 b _(i). One end of the constant current source 41 a _(j) and theconstant current source 41 b _(j) is grounded.

The drain of the signal detection transistor 12 in the pixel cell 20_(i,j) on the (i)th row and the drain of the signal detection transistor12 in the pixel cell 20 _(i+1,j) on the (i+1)th row both are connectedto a power supply line 34 _(j). The power supply line 34 _(j) isprovided for each column of the multiple pixel cells 20. A switchingcircuit 45 _(j) is connected to one end of the power supply line 34_(j). The switching circuit 45 _(j) includes a switching element Ss1connected between the supply source of a certain first voltage VA1 andthe power supply line 34 _(j), and a switching element Ss2 connectedbetween the supply source of a certain second voltage VA2 and the powersupply line 34 _(j). Typically, the first voltage VA1 and the secondvoltage VA2 are the power supply voltage VDD and ground (GND),respectively. An amplifier is configured by the switching circuit 45 andthe signal detection transistor 12 in each pixel cell 20.

The first feedback circuit FCc in the pixel cell 20 _(i,j) on the (i)throw includes a feedback transistor 19 _(i,j), in which one of the sourceand the drain is connected to the charge accumulation node FD. The otherof the source and the drain of the feedback transistor 19 _(i,j) isconnected by a feedback line 54 _(i,j) to a node between the signaldetection transistor 12 and the address transistor 14. The parasiticcapacitance of the feedback transistor 19 _(i,j) and the chargeaccumulation node FD constitutes an RC filter circuit. By switching onthe feedback transistor 19 _(i,j) on the (i)th row through control ofthe gate voltage FB_(i) of the feedback transistor 19 _(i,j), there isformed a first feedback circuit that negatively feeds back theelectrical signal of the photoelectric converter 11 of the pixel cell 20_(i,j). In the third embodiment, the first feedback circuit is closedinside the pixel cell 20 _(i,j).

The second feedback circuit FCb in the pixel cell 20 _(1+i,j) on the(i+1)th row, similarly to the first feedback circuit FCc, includes afeedback transistor 19 _(1+1,j) in which one of the source and the drainis connected to the charge accumulation node FD. The other of the sourceand the drain of the feedback transistor 19 _(i+1,j) is connected by afeedback line 54 _(i+1,j) to a node between the signal detectiontransistor 12 and the address transistor 14. By switching on thefeedback transistor 19 _(1+i,j) on the (i+1)th row, there is formed asecond feedback circuit that negatively feeds back the electrical signalof the photoelectric converter 11 of the pixel cell 20 _(1+i,j). Herein,the second feedback circuit is also closed inside the pixel cell 20_(i+1,j).

At this point, a typical example of operations during signal readout andduring feedback reset in each pixel cell 20 will be described briefly.For example, during the readout of a signal from the pixel cell 20_(i,j) on the (i)th row, with the address transistor 14 on the (i)th rowswitched on, the switching element Ss1 of the switching circuit 45 _(j)connected to the power supply line 34 _(j) and the switching element Solof the switching circuit 44 a _(j) connected to the first output signalline 30 a _(j) are switched on. At this point, the switching element Ss2of the switching circuit 45 _(j) and the switching element So2 of theswitching circuit 44 a _(j) are switched off. Consequently, the voltageVA1 (a power supply voltage, for example) is supplied to the drain ofthe signal detection transistor 12 of the pixel cell 20 _(i,j). At thispoint, the signal detection transistor 12 and the constant currentsource 41 a _(j) form a source follower, and a voltage corresponding tothe amount of charge accumulated in the charge accumulation node FD isread out to the first output signal line 30 a _(j). The amplificationratio of the source follower at this point is approximately 1×.

During the readout of a signal from the pixel cell 20 _(i+1,j) on the(i+1)th row, with the address transistor 14 on the (i+1)th row switchedon, the switching element Ss1 of the switching circuit 45 _(j) and theswitching element Se1 of the switching circuit 44 b _(j) connected tothe second output signal line 30 b _(j) are switched on. At this point,it is sufficient to switch off the switching element Ss2 of theswitching circuit 45 _(j) and the switching element Se2 of the switchingcircuit 44i b_(j). Consequently, the voltage VA1 is supplied to thedrain of the signal detection transistor 12 of the pixel cell 20_(i+1,j). At this point, a source follower is formed by the signaldetection transistor 12 and the constant current source 41 b _(j), and avoltage corresponding to the amount of charge accumulated in the chargeaccumulation node FD of the pixel cell 20 _(i+1,j) is read out to thesecond output signal line 30 b _(j).

On the other hand, during a feedback reset, the address transistor 14 inthe pixel cell 20 which is subject to the feedback reset is switched on.For example, in the case of executing a feedback reset on the pixel cell20 _(i,j) on the (i)th row, the address transistor 14 on the (i)th rowis switched on. In the case of executing a feedback reset on the pixelcell 20 _(i+1,j) on the (i+1)th row, the address transistor 14 on the(i+1)th row is switched on.

For example, in the case of executing a feedback reset on the pixel cell20 _(i,j) on the (i)th row, with the address transistor 14 on the (i)throw switched on, the feedback transistor 19 _(i,j) is switched on.Consequently, there is formed a first feedback path that negativelyfeeds back the output of the signal detection transistor 12 to one ofthe source and the drain of the feedback transistor 19 _(i,j). At thispoint, by switching the switching element Ss1 and the switching elementSs2 of the switching circuit 45 _(j) connected to the power supply line34 _(j) off and on, respectively, the voltage VA2 (herein, ground) isapplied to the signal detection transistor 12. Also, the switchingelement Sol and the switching element So2 of the switching circuit 44 a_(j) connected to the first output signal line 30 a _(j) are switchedoff and on, respectively. Consequently, the voltage of the chargeaccumulation node FD of the pixel cell 20 _(i,j) is reset to a certainvoltage.

Subsequently, the voltage level of the feedback control signal FB_(i) islowered to a level between the high level and the low level, forexample, and after that, the feedback control signal FB_(i) is set tothe low level. By setting the voltage level of the feedback controlsignal FB_(i) to a level lower than the high level, the operating bandof the feedback transistor 19 _(i,j) becomes narrower compared to whenthe feedback control signal FB_(i) is at the high level. When thefeedback control signal FB_(i) reaches the low level, the feedbacktransistor 19 _(i,j) switches off, and the formation of the firstfeedback path is dissolved. At this point, if the operating band of thefeedback transistor 19 _(i,j) is in a lower state than the operatingband of the signal detection transistor 12, the kTC noise produced bythe switching off of the feedback transistor 19 _(i,j) becomes smallcompared to the case of not forming the first feedback path. Providedthat (−D) is the amplification ratio of the amplifier formed by theswitching circuit 45 and the signal detection transistor 12, the kTCnoise produced by the switching off of the feedback transistor 19 i,j issuppressed by a factor of (1/(1+D))^(1/2) compared to the case of notforming the first feedback path. In this way, with the feedback controlsignal FB_(i), band limiting of the feedback transistor 19 _(i,j) ispossible. The value of D may be set to a numerical value greater than 1,ranging approximately from several tens to several hundred. Likewise, inthe case of executing a feedback reset on the pixel cell 20 _(i+1,j) onthe (i+1)th row, for example, it is sufficient to execute controlsimilar to the above.

In the third embodiment, by switching the current with respect to thepixel cell 20, the signal detection transistor is made to function as asource follower during signal readout, and as an amplifier duringfeedback reset. As discussed above, even when a feedback path is formedinside each pixel, the kTC noise remaining in the charge accumulationnode FD may be suppressed compared to the case of no feedback. Note thatcontrol may also be executed in which a ramp voltage is used as thefeedback control signal FB_(i), so that the voltage level of thefeedback control signal FB_(i) decreases from the high level to the lowlevel. Note that in the imaging device 300 illustrated in FIG. 15, thepower supply line 34 _(j) and the switching circuit 45 _(j) are sharedbetween the pixel cell 20 _(i,j) and the 20 _(i+1,j). However, asillustrated in FIG. 27, a power supply line 34 a _(j) and a switchingcircuit 45 a _(j) may be provided for the pixel cell 20 _(i,j), while apower supply line 34 b _(j) and a switching circuit 45 b _(j) may beprovided for the pixel cell 20 _(i+1,j).

FIG. 16 illustrates an overview of an exemplary circuit configuration ofan imaging device according to the third embodiment of the presentdisclosure. The imaging device 400 illustrated in FIG. 16 includes acommon voltage line 36 that supplies the first voltage VA1 discussedearlier, and a common voltage line 55 that supplies the second voltageVA2 discussed earlier. In this example, one end of the switching elementSs1 and one end of the switching element Ss2 in the switching circuit 45j provided in correspondence with each column are connected to thecommon voltage lines 36 and 55, respectively. For example, bycontrolling the switching on and off of the switching element Ss1 andthe switching element Ss2 in the switching circuit 45 _(j) on the (j)thcolumn, the voltage Vsrs_(j) of the power supply line 34 _(j) on the(j)th column may be switched between the first voltage VA1 and thesecond voltage VA2.

The imaging device 400 illustrated as an example in FIG. 16 includes adummy cell 49 as a replica of the pixel cell 20 outside the pixel arrayPA. The dummy cell 49 includes a first dummy transistor 12 d, a seconddummy transistor 14 d, and a third dummy transistor 19 d. The firstdummy transistor 12 d, the second dummy transistor 14 d, and the thirddummy transistor 19 d have a similar configuration to the signaldetection transistor 12, the address transistor 14, and the feedbacktransistor 19 of each pixel cell 20 included in the pixel array PA,respectively.

The source of the first dummy transistor 12 d is connected to the drainof the second dummy transistor 14 d. The source of the second dummytransistor 14 d is connected to a switching circuit 44 d that includesswitching elements Sd1 and Sd2. During operation of the imaging device400, an address control signal SEL_(d) is applied to the gate of thesecond dummy transistor 14 d. During operation of the imaging device400, the second dummy transistor 14 d may be in the on statecontinuously.

As illustrated, the switching element Sd1 is connected between thesecond dummy transistor 14 d and a constant current source Cd1, whilethe switching element Sd2 is connected between the second dummytransistor 14 d and a constant current source Cd2. The pair of theconstant current sources Cd1 and Cd2 is a pair of current sources havinga configuration similar to the pair of the constant current sources 41 aand 42 a as well as the pair of the constant current sources 41 b and 42b discussed earlier. The constant current sources Cd1 and Cd2 may beshared in common with the constant current sources 41 a and 42 a or withthe constant current sources 41 b and 42 b discussed earlier. Typically,the operation of switching on and off the switching elements Sd1 and Sd2of the switching circuit 44 d is shared in common with the operation ofswitching on and off the switching elements So1 and So2 of the switchingcircuit 44 a or the switching elements Se1 and Se2 of the switchingcircuit 44 b discussed earlier.

Meanwhile, the drain of the first dummy transistor 12 d is connected toa switching circuit 45 d that includes switching elements Sds1 and Sds2.The switching element Sds1 is connected between the first dummytransistor 12 d and the common voltage line 36, while the switchingelement Sds2 is connected between the first dummy transistor 12 d andthe common voltage line 55. Typically, the operation of switching on andoff the switching elements Sds1 and Sds2 of the switching circuit 45 dis shared in common with the operation of switching on and off theswitching elements Ss1 and Ss2 of the switching circuit 45 discussedearlier. The common voltage line 36 has a connection to a power supply(not illustrated), and as a result of the switching element Sds1 beingswitched on, the first voltage VA1 is supplied to the dummy cell 49.

One of the source and the drain of the third dummy transistor 19 d isconnected to the gate of the first dummy transistor 12 d. The other ofthe source and the drain of the third dummy transistor 19 d is connectedto the source of the first dummy transistor 12 d. The gate voltage FB ofthe third dummy transistor 19 d may be controlled similarly to thefeedback control signal FB_(i) for the pixel cells 20. If the thirddummy transistor 19 d is switched on by control of the gate voltage FB,a feedback circuit similar to the first or second feedback circuit inthe pixel cells 20 may be formed inside the dummy cell 49. Also, byswitching off the third dummy transistor 19 d, the formation of thisfeedback circuit is dissolved. Through control of the gate voltage FB ofthe third dummy transistor 19 d, it is possible to generate a voltagelevel similar to a voltage acquired by a feedback reset in the pixelcells 20. The generated voltage is supplied to the second switchingcircuit 42 via a reference signal line 53, one end of which is connectedto the node between the second dummy transistor 14 d and the switchingcircuit 44 d. The other end of the reference signal line 53 is connectedto the third switching element S3 of the second switching circuit 42.

By sharing the first voltage VA1 between each of the pixel cells 20 andthe dummy cell 49, with the dummy cell 49 it is possible to generate avoltage level similar to a voltage acquired by a feedback reset in eachof the pixel cells 20. In other words, a voltage nearly equal to thedark level of each of the pixel cells 20 may be generated by the dummycell 49. Namely, the voltage generated by the dummy cell 49 is a voltagecorresponding to the reset voltage of the pixel cells 20. By utilizingthe voltage generated by the dummy cell 49, fixed-pattern noise may beremoved based on a voltage level similar to the voltage acquired by afeedback reset in each of the pixel cells 20, thereby making it possibleto suppress a reduction in dynamic range.

FIG. 17 illustrates a typical example of the changes in the controlsignals for each transistor and each switching element when applying thefirst operational example described with reference to FIG. 4 to theimaging device 400. In FIG. 17, the graphs of φo1, φo2, φe1, φe2, φs1,and φs2 represent changes in the control signals of the switchingelements So1 and So2 of the switching circuit 44 a, the switchingelements Se1 and Se2 of the switching circuit 44 b, and the switchingelements Ss1 and Ss2 of the switching circuit 45, respectively. Theswitching elements Sol and So2, the switching elements Se1 and Se2, andthe switching elements Ss1 and Ss2 are all taken to be switched on whenthe control signal is at the high level.

The respective graphs on the left side of FIG. 17 will be referenced. Inthis example, in the reset signal readout period RR following the imagesignal readout period SR for reading out from the pixel cell 20 _(1,j)on the 1st row, the feedback reset FBr1 is executed in the pixel cell 20_(k,j) on the kth row. In the image signal readout period SR for readingout from the pixel cell 20 _(1,j) on the 1st row, the address controlsignal SEL₁ is set to the high level. At this point, the control signalφs1 is at the high level, and the first voltage VA1 is supplied to thepixel cell 20 _(1,j) on the 1st row. Also, at this time, by setting thecontrol signals φ1 and φ4 to the high level, the column circuit 44 _(j)becomes electrically connected to the first output signal line 30 a_(j). As illustrated, among the control signals φo1, φo2, φe1, and φe2,by setting φo1 to the high level and the others to the low level, avoltage V_(SL1) corresponding to the voltage of the charge accumulationnode FD of the pixel cell 20 _(1,j) is applied to the column circuit 44_(j).

In the reset signal readout period RR following the period SR, byswitching the control signals φ3 and φ4 to the high level and the lowlevel, respectively, the column circuit 44 is electrically connected tothe reference signal line 53. The column circuit 44 _(j) acquires, viathe reference signal line 53, a voltage level V_(dm) generated by thedummy cell 49 and corresponding to the reset signal. A signal obtainedby subtracting the voltage level V_(dm) from the voltage level V_(SL1)acquired in the period SR is output from the column circuit 44 _(j) asthe image signal Si of the pixel cell 20 _(1,j).

In this example, the feedback reset FBr2 is executed on the pixel cell20 _(1,j) in the readout period RR. At this time, the control signalsφo2 and φs2 are switched to the high level. The feedback reset FBr2 isexecuted by continuously or discontinuously varying the feedback controlsignal FB₁ from the high level to the low level so as to pass through anintermediate voltage level.

Additionally, in this example, in the readout period RR of the pixelcell 20 _(1,j), in parallel with the feedback reset FBr2 of the pixelcell 20 _(1,j), the feedback reset FBr1 is executed as an electronicshutter on the pixel cell 20 _(k,j) on the kth row. At this point, thecontrol signal φe2 is switched to the high level, but the first outputsignal line 30 a _(j) and the second output signal line 30 b _(j) are inan electrically isolated state. Consequently, like in this example,while executing the feedback reset FBr2 on a certain row, it is possibleto execute the feedback reset FBr1 on another row.

Next, the respective graphs on the right side of FIG. 17 will bereferenced. Herein, image signal readout from the pixel cell 20 _(k,j)on the kth row is being executed (period SR). The control for the imagesignal readout from the pixel cell 20 _(k,j) on the kth row is mostlysimilar to the control for the image signal readout from the pixel cell20 _(1,j) on the 1st row. In the image signal readout from the pixelcell 20 _(k,j) on the kth row, by setting the control signals φ2 and φ4to the high level, the second output signal line 30 b _(j) and thecolumn circuit 44 _(j) become electrically connected. Also, with theaddress transistor 14 of the pixel cell 20 _(k,j) switched on, thecontrol signals φs1 and φe1 are switched to the high level.Consequently, a voltage V_(SLk) corresponding to the voltage of thecharge accumulation node FD of the pixel cell 20 _(k,j) is applied tothe column circuit 44 _(j).

In the reset signal readout period RR following the period SR, byswitching the control signals φ3 and φ4 to the high level and the lowlevel, respectively, the column circuit 44 j is electrically connectedto the reference signal line 53, and a voltage level V_(dm)corresponding to a reset signal from the dummy cell 49 is applied to thecolumn circuit 44 _(j). A signal obtained by subtracting the voltagelevel V_(dm) from the voltage level V_(SLk) acquired in the period SR isoutput from the column circuit 44 as the image signal Sk of the pixelcell 20 _(k,j).

FIG. 18 illustrates a typical example of the changes in the controlsignals for each transistor and each switching element, in the case ofapplying the second operational example outlined in FIG. 7 to theimaging device 400.

The respective graphs on the left side of FIG. 18 will be referenced.Compared to FIG. 17 discussed above, in this example, the feedback resetFBr2 following the period RR on the 1st row is omitted, and the feedbackreset FBr1 on the kth row is executed in parallel with the reset signalreadout.

The control of each transistor and each switching element for the imagesignal readout from the pixel cell 20 _(1,j) on the 1st row may besimilar to the control described with reference to FIG. 17. After that,by switching the control signal φ3 to the high level, in the period RR,a voltage level V_(dm) corresponding to a reset signal is applied fromthe dummy cell 49 to the column circuit 44 via the reference signal line53.

At this point, if exposure is executed subsequently with the feedbackcontrol signal FB₁ at the low level, an operation of additionallyaccumulating signal charge, or in other words non-destructive readout,is possible, as illustrated by the graph of VSIGa_(j). The controlsignals φo2 and φs2 may also be set to the low level together withsetting the feedback control signal FB₁ to the low level.

As illustrated, herein, in the reset signal readout period RR, thefeedback reset FBr1 is executed in the pixel cell 20 _(k,j) on the kthrow. The control of each transistor of the pixel cell 20 _(k,j) in thefeedback reset FBr₁ on the pixel cell 20 _(k,j) on the kth row may besimilar to the control described with reference to FIG. 17.

Next, the respective graphs on the right side of FIG. 18 will bereferenced. The control of each transistor and each switching elementfor the image signal readout from the pixel cell 20 _(k,j) on the kthrow likewise may be similar to the control described with reference toFIG. 17. Also, the operation during the acquisition of the voltage levelV_(dm) corresponding to the reset signal in the period RR is similar tothe case of the pixel cell 20 _(1,j) on the 1st row. Note that in thisexample, the feedback control signal FB_(k) is set to the low level inthe period RR. In other words, in FIG. 18, control when applyingnon-destructive readout is illustrated as an example. Note that theapplicability of the third operational example in the third embodimentas well is understood easily by persons skilled in the art.

According to the third embodiment, with a feedback reset, the kTC noiseproduced by the switching off of the feedback transistor 19 _(i,j) issuppressed by a factor of (1/(1+D))^(1/2) compared to the case of notforming the feedback path. Since the image signal is output to theoutput signal line (the first output signal line 30 a or the secondoutput signal line 30 b) at an amplification ratio of approximately 1×,image data with suppressed kTC noise is acquired. Additionally, asdescribed with reference to FIG. 16, by generating a dark level with thedummy cell 49 and computing the difference between the voltage level ofthe image signal and the dark level, it is possible to suppress areduction in dynamic range. Note that a reference-signal generatoraccording to the present disclosure is exemplified by the dummy cell 49in the present embodiment.

(Modifications)

FIG. 19 illustrates another example of a readout circuit. In theconfiguration illustrated as an example in FIG. 19, a switching circuit43 _(j) is connected between the pair of the first output signal line 30aj and the first feedback line 52 a _(j), and the reference voltage line46, and also between the pair of the second output signal line 30 b _(j)and the second feedback line 52 b _(j), and the reference voltage line46. The switching circuit 43 j includes multiple switching elements forswitching between the formation and dissolution of the first feedbackpath discussed earlier, and also between the formation and dissolutionof the second feedback path. Additionally, the column circuit 44A_(j) inthe configuration illustrated as an example in FIG. 19 includes acomparator 44C having a connection to a voltage line 44R that supplies aramp voltage Vrmp.

As exemplified in FIG. 19, a switching circuit 47 _(j) may also beconnected between the pair of the first output signal line 30 aj and thesecond output signal line 30 b _(j), and the pair of the constantcurrent sources 40 a _(j) and 40 b _(j). The switching circuit 47 jincludes one or more switching elements that switch whether to connectthe constant current sources 40 a _(j) and 40 b _(j) to the first outputsignal line 30 a _(j) or the second output signal line 30 b _(j).

For example, as illustrated in FIG. 19, by connecting both of theconstant current sources 40 a _(j) and 40 b _(j) to the first outputsignal line 30 a _(j), the amount of current flowing through the firstoutput signal line 30 a _(j) may be increased compared to the case ofconnecting only the constant current source 40 a _(j) to the firstoutput signal line 30 a _(j). In other words, the signal current may beincreased to enable faster signal readout. Similarly, as illustrated inFIG. 20, by connecting both of the constant current sources 40 a _(j)and 40 b _(j) to the second output signal line 30 b _(j), the signalcurrent may be increased compared to the case of connecting only theconstant current source 40 b _(j) to the second output signal line 30 b_(j), thereby increasing the speed of signal readout via the secondoutput signal line 30 b _(j).

FIG. 21 illustrates another example of a circuit configuration of apixel cell which is applicable to the first and second embodiments. Themajor difference between the pixel cell 15 _(i,j) illustrated in FIG. 21and the pixel cell 10 _(i,j) described with reference to FIG. 5 is thatin the pixel cell 15 _(i,j), the charge accumulation node FD and thefeedback line 52 _(j) (in the example illustrated in FIG. 20, the firstfeedback line 52 a _(j)) are connected via the feedback transistor 18.The pixel cell 15 i,j does not include the reset transistor 16, thefirst capacitive element 21, and the second capacitive element 22 in thepixel cell 10 _(i,j) discussed earlier.

A simpler circuit configuration as illustrated in FIG. 21 may also beadopted. The control of the feedback control signal FB_(i) with respectto the feedback transistor 18 in the pixel cell 15 _(i,j) may be similarto the control of the feedback control signal FB_(i) with respect to thefeedback transistor 19 _(i,j) described with reference to FIG. 15. Inother words, it is possible to execute the feedback reset discussedearlier by continuously or discontinuously varying the feedback controlsignal FB_(i) from the high level to the low level so as to pass throughan intermediate voltage level.

FIG. 22 illustrates another example of a circuit configuration of apixel cell which is applicable to the third embodiment. The majordifference between the pixel cell 25 _(i,j) illustrated in FIG. 22 andthe pixel cell 20 _(i,j) described with reference to FIG. 15 is that thesignal detection circuit SC of the pixel cell 25 _(i,j) includes aconstant current source Cc connected to the node between the addresstransistor 14 and the signal detection transistor 12.

As exemplified in FIG. 22, by disposing the constant current source Ccinside each pixel cell 25 _(i,j), it is possible to complete a feedbackreset (for example, the feedback reset FBr1 that acts as an electronicshutter) entirely inside the pixel cell 25 _(i,j). In other words, it ispossible to execute a feedback reset without using an output signal line30 _(j) (in the example illustrated in FIG. 22, the first output signalline 30 a _(j)), and thus noise may be reduced faster. Note that theconstant current source Cc may also be shared in common among multiplepixel cells 25. By sharing the constant current source Cc in commonamong multiple pixel cells 25, the number of elements per cell may bedecreased.

FIGS. 23 and 24 are diagrams for explaining the effects obtained byalternately arranging, in the column direction on the same column ofmultiple pixel cells, a pixel cell connected to the first output signalline 30 a and a pixel cell connected to the second output signal line 30b.

In the foregoing embodiments, an example is given in which a pixel cellconnected to the first output signal line 30 a and a pixel cellconnected to the second output signal line 30 b are arranged alternatelyin the column direction. However, the arrangement of these two types ofpixel cells is not limited to the foregoing example. For example, two ormore pixel cells connected to the second output signal line 30 b mayalso be disposed between two pixel cells connected to the first outputsignal line 30 a. As another example, pixel cells connected to the firstoutput signal line 30 a and pixel cells connected to the second outputsignal line 30 b may be arranged alternately in units of h rows (where his an integer equal to or greater than 2). However, arranging a pixelcell connected to the first output signal line 30 a and a pixel cellconnected to the second output signal line 30 b alternately in thecolumn direction may improve the degree of freedom in control of theexposure time for each pixel cell, as described below.

FIG. 23 is a diagrammatic illustration of a configuration in which apixel cell 10 connected to the first output signal line 30 a _(j) and apixel cell 10 connected to the second output signal line 30 b _(j) arearranged alternately in the column direction. On the other hand, FIG. 24is a diagrammatic illustration of a configuration in which a pixel cell10 connected to the first output signal line 30 a _(j) and a pixel cell10 connected to the second output signal line 30 b _(j) are arrangedalternately in units of two rows in the column direction. FIGS. 23 and24 both illustrate a state of executing signal readout from the pixelcell 10 _(i+4,j) connected to the first output signal line 30 a _(j). Atthis time, signal readout from the other pixel cells having a connectionto the first output signal line 30 a _(j) (10 _(i,j) and 10 _(i+2,j) inthe configuration of FIG. 23, or 10 _(i,j) and 10 _(i+3,j) in theconfiguration of FIG. 24) is stopped.

As already described, according to an embodiment of the presentdisclosure, it is possible to execute, in parallel with signal readoutfrom the pixel cell 10 _(i+4,j) connected to the first output signalline 30 a _(j), an electronic shutter on the pixel cells 10 connected tothe second output signal line 30 b _(j). In the configuration of FIG.24, the timings of the electronic shutter for the pixel cells 10connected to the second output signal line 30 b _(j) are after a 2Hperiod (pixel cell 10 _(i+2,j)), after a 3H period (pixel cell 10_(i+1,j)), after a 6H period, after a 7H period, after a 10H period, andafter an 11H period from the readout of a signal from the pixel cell 10_(1+4,j). Consequently, the configuration of FIG. 24 requires the use ofa complicated formula as a general formula to specify a pixel cell onwhich the electronic shutter may be executed during signal readout fromthe pixel cell 10 _(i+4,j), and control of the exposure time becomescomplicated. In contrast, with the configuration of FIG. 23, it ispossible to use a simpler general formula to specify a pixel cell onwhich the electronic shutter may be executed during signal readout fromthe pixel cell 10 _(i+4,j). Consequently, the degree of freedom incontrol may be improved. In this way, from the perspective of control ofthe exposure time, it is desirable to dispose a pixel cell 10 connectedto the first output signal line 30 a _(j) every other row and dispose apixel cell 10 connected to the second output signal line 30 b _(j) everyother row, or in other words, alternately arrange the two types of pixelcells 10 in the column direction.

Also, in the foregoing embodiments, a configuration in which two outputsignal lines are provided for each column is illustrated as an example.However, the number of output signal lines to provide for each column isnot limited to two. For example, in the configuration of Embodiment 1illustrated in FIG. 1, four output signal lines may be disposed for eachcolumn. By taking a configuration in this way, signals may be read outfaster. In the following, the description will be reduced or omitted forparts of the configuration shared in common with FIG. 1.

FIG. 25 illustrates an overview of an exemplary circuit configuration ofan embodiment provided with four output signal lines for each column. InFIG. 25, four pixel cells 10 lined up in the column direction areillustrated as a representative example. In the present embodiment, agroup of four output signal lines are provided for each column of thepixel cells 10. For example, on the (j)th column of the pixel array PA,a first output signal line 30 a _(j), a second output signal line 30 b_(j), a third output signal line 30 c _(j), and a fourth output signalline 30 d _(j) are arranged extending in the column direction. Aconstant current source made up of a load transistor and the like isconnected to one end of each output signal line. In the illustratedexample, constant current sources 40 a _(j), 40 b _(j), 40 c _(j), and40 d _(j) are connected respectively to one end of the first outputsignal line 30 a _(j), the second output signal line 30 b _(j), thethird output signal line 30 c _(j), and the fourth output signal line 30d _(j) of the (j)th column.

Each pixel cell 10 has a connection to one from among the first outputsignal line 30 a, the second output signal line 30 b, the third outputsignal line 30 c, and the fourth output signal line 30 d. In thisexample, among the multiple pixel cells 10 belonging to the (j)thcolumn, the pixel cell 10 _(i,j) on the (i)th row is connected to thefirst output signal line 30 a _(j), the pixel cell 10 _(1+1,j) on the(i+1)th row is connected to the second output signal line 30 b _(j), thepixel cell 10 _(i+2,j) on the (i+2)th row is connected to the thirdoutput signal line 30 c _(j), and the pixel cell 10 _(1+3,j) on the(i+3)th row is connected to the fourth output signal line 30 d _(j).

The first output signal line 30 a, the second output signal line 30 b,the third output signal line 30 c, and the fourth output signal line 30d for each column of the pixel cells 10 are connected to the switchingcircuit 41. As illustrated, the switching circuit 41 is connectedbetween the group of the first output signal line 30 a, the secondoutput signal line 30 b, the third output signal line 30 c, and thefourth output signal line 30 d, and the column circuit 44 provided incorrespondence with each column of the pixel cells 10. A secondswitching circuit 42 is connected between the switching circuit 41 andthe column circuit 44.

The switching circuit 41 includes a first switching element S1 connectedto the first output signal line 30 a, a second switching element S2connected to the second output signal line 30 b, a third switchingelement S3 connected to the third output signal line 30 c, and a fourthswitching element S4 connected to the fourth output signal line 30 d.The first switching element S1, the second switching element S2, thethird switching element S3, and the fourth switching element S4 arecontrolled so that one among the four is connected, while the otherthree are disconnected. Note that in the case of mixing signals frommultiple pixel cells, the first switching element S1, the secondswitching element S2, the third switching element S3, and the fourthswitching element S4 may also be controlled so that multiple switchingelements among the four are connected at the same time.

The switching circuit 42 includes a fifth switching element S5 and asixth switching element S6. The sixth switching element S6 is connectedbetween the column circuit 44 and the switching circuit 41. The fifthswitching element S5 is connected between the column circuit 44 and thereference voltage line 46. The fifth switching element S5 and the sixthswitching element S6 in the second switching circuit 42 are controlledto operate in a complementary manner.

The imaging device 600 includes, for each column of the pixel cells 10,a first feedback circuit FCa, a second feedback circuit FCb, a thirdfeedback circuit FCc, and a fourth feedback circuit FCd. The firstfeedback circuit FCa, the second feedback circuit FCb, the thirdfeedback circuit FCc, and the fourth feedback circuit FCd include afirst inverting amplifier 50 a, a second inverting amplifier 50 b, athird inverting amplifier 50 c, and a fourth inverting amplifier 50 d,respectively. As illustrated, the first output signal line 30 a isconnected to the inverting input terminal of the first invertingamplifier 50 a. A first feedback line 52 a is connected to the outputterminal of the first inverting amplifier 50 a. The pixel cells 10having a connection to the first output signal line 30 a are connectedto the first feedback line 52 a. The inverting input terminal of thesecond inverting amplifier 50 b is connected to the second output signalline 30 b. A second feedback line 52 b is connected to the outputterminal of the second inverting amplifier 50 b, and the pixel cells 10having a connection to the second output signal line 30 b are connectedto the second feedback line 52 b. The inverting input terminal of thethird inverting amplifier 50 c is connected to the third output signalline 30 c. A third feedback line 52 c is connected to the outputterminal of the third inverting amplifier 50 c, and the pixel cells 10having a connection to the third output signal line 30 c are connectedto the third feedback line 52 c. The inverting input terminal of thefourth inverting amplifier 50 d is connected to the fourth output signalline 30 d. A fourth feedback line 52 d is connected to the outputterminal of the fourth inverting amplifier 50 d, and the pixel cells 10having a connection to the fourth output signal line 30 d are connectedto the fourth feedback line 52 d. The non-inverting input terminals ofthe first inverting amplifier 50 a, the second inverting amplifier 50 b,the third inverting amplifier 50 c, and the fourth inverting amplifier50 d are all connected to the reference voltage line 46.

According to the imaging device 600 configured as above, signal readoutand feedback reset may be performed in parallel among pixel cells 10respectively connected to each of the first output signal line 30 a, thesecond output signal line 30 b, the third output signal line 30 c, andthe fourth output signal line 30 d. Specifically, for example, inparallel with performing signal readout for one pixel cell 10, afeedback reset may be performed for three other pixel cells 10.Consequently, it is possible to read out signals for forming the imageof one frame faster while also reducing the influence of noise, and ahigh frame rate may be realized.

In FIG. 25, a configuration that includes four output signal lines foreach column and has the feedback circuit of Embodiment 1 illustrated inFIG. 1 as an example is described. Similar modifications are alsopossible for other feedback circuits of the foregoing embodiments. Forexample, in the case of the configuration illustrated in FIG. 13, it issufficient to add an output signal line 30, a feedback line 52, and aconstant current source 40 in correspondence with each of the pixel cell10 _(1+2,j) and the pixel cell 10 _(i+3,j). Furthermore, it issufficient to increase the number of switching elements in the switchingcircuit 41 and the switching circuit 43 according to the number ofoutput signal lines 30 and feedback lines 52. Note that the invertingamplifier 50 j may be shared among four pixel cells, or anotherinverting amplifier 50 j may be added for use with the pixel cell 10_(i+2,j) and the pixel cell 10 _(i+3,j).

As another example, in the case of the configuration illustrated in FIG.15, it is sufficient to add an output signal line 30, a column circuit44 connected to the output signal line 30, and respective constantcurrent sources 41 and 42 in correspondence with each of the pixel cell20 _(i+2,j) and the pixel cell 20 _(i+3,j). Note that the power supplyline 34 _(j) and the switching circuit 45 _(j) may be shared among fourpixel cells, or another group of a power supply line 34 j and aswitching circuit 45 j may be added for use with the pixel cell 20_(i+2,j) and the pixel cell 20 _(i+3j).

As another example, in the case of the configuration illustrated in FIG.16, it is sufficient to add an output signal line 30, a column circuit44 connected to the output signal line 30, and respective constantcurrent sources 41 and 42 in correspondence with each of the pixel cell20 _(i+2,j) and the pixel cell 20 _(i+3,j). Furthermore, it issufficient to increase the number of switching elements in the switchingcircuit 41 according to the number of output signal lines 30. Note thatthe power supply line 34 _(j) and the switching circuit 45 _(j) may beshared among four pixel cells, or another group of a power supply line34 j and a switching circuit 45 j may be added for use with the pixelcell 20 _(i+2,j) and the pixel cell 20 _(i+3,j).

As described above, in the case of increasing the number of outputsignal lines provided for each column, it is sufficient to add verticalsignal lines, feedback lines, or switching elements in the switchingcircuit, depending on the circuit configuration. In other words, thecircuit configurations of the foregoing embodiments, such as thoseillustrated in FIGS. 1, 13, 15, and 16, may still be used even in thecase of providing three or more output signal lines for each column.

Note that even in the case of providing three or more output signallines for each column, it is desirable to arrange periodically, in thecolumn direction, the pixel cells connected to each output signal line.For example, in the case of providing four output signal lines for eachcolumn, it is desirable to arrange a first pixel cell connected to thefirst output signal line every four rows, and arrange a second pixelcell connected to the second output signal line every four rows.Additionally, it is desirable furthermore to arrange a third pixel cellconnected to the third output signal line every four rows, and arrange afourth pixel cell connected to the fourth output signal line every fourrows. By arranging the pixel cells in this way, it becomes possible touse a simple general formula to specify imaging cells on rows on whichthe electronic shutter can be executed when readout from a pixel cell ona certain row is executed.

FIG. 26 illustrates an example configuration of a camera systemincluding an imaging device according to an embodiment of the presentdisclosure. The camera system 1000 illustrated in FIG. 26 includes alens optical system 101, an imaging device 700, a camera signalprocessing unit 102, and a system controller 103. For the imaging device700, any of the imaging devices 100 to 400 and 600 discussed earlier maybe applied.

The lens optical system 101 includes an autofocus lens, a zoom lens, anda diaphragm, for example. The lens optical system 101 focuses light ontothe imaging surface of the imaging device 700. The camera signalprocessing unit 102 functions as a signal processing circuit thatprocesses an output signal from the imaging device 700. The camerasignal processing unit 102 executes processing such as gamma correction,color interpolation processing, spatial interpolation processing, andauto white balance, for example, and outputs image data (or a signal).The camera signal processing unit 102 may be realized by a componentsuch as a digital signal processor (DSP), for example. The systemcontroller 103 controls the camera system 1000 as a whole. The systemcontroller 103 may be realized by a microprocessor, for example. Byapplying one of the foregoing embodiments as the imaging device 700, itis possible to achieve both noise reduction and fast signal readout.

As discussed above, according to an embodiment of the presentdisclosure, it is possible to achieve both noise reduction and fastsignal readout. An embodiment of the present disclosure is usefulparticularly in a laminated imaging device for which a technique ofproviding a transfer transistor inside the pixel cells and applyingcorrelated double sampling is typically difficult to apply simply. Also,according to an embodiment of the present disclosure, non-destructivereadout is also possible in which a signal generated by a photoelectricconverter is read out continuously while maintaining the amount ofsignal charge accumulated in the charge accumulation node FD.Non-destructive readout is useful for sensing, and is useful inapplications such as drones (such as unmanned wheeled vehicles, unmannedaircraft, or unmanned marine vessels), robots, factory automation (FA),and motion capture, for example.

Note that each of the signal detection transistor 12, the addresstransistor 14, the reset transistor 16, the feedback transistors 18 and19, the first dummy transistor 12 d, the second dummy transistor 14 d,and the third dummy transistor 19 d discussed above may be an n-channelMOSFET or a p-channel MOSFET. It is not necessary for all of the aboveto be n-channel MOSFETs or p-channel MOSFETs uniformly. Besides FETs,bipolar transistors may also be used as the transistors.

An imaging device according to the present disclosure is useful inapparatus such as image sensors and digital cameras, for example. Animaging device of the present disclosure may be used in apparatus suchas a medical camera, a robot camera, a security camera, or a camera usedonboard a vehicle.

What is claimed is:
 1. An imaging device, comprising: pixels arranged ina matrix having rows and columns, the pixels including first pixels andsecond pixels different from the first pixels, the first pixels and thesecond pixels being located in one of the columns, each of the pixelscomprising: a photoelectric converter that converts incident light intosignal charge, and a first transistor having a first gate, a firstsource and a first drain, the first gate being coupled to thephotoelectric converter, a first line coupled to one of the first sourceand the first drain of each of the first pixels; a second line coupledto one of the first source and the first drain of each of the secondpixels, the second line being different from the first line; a thirdline coupled to the other of the first source and the first drain ofeach of the first pixels; and voltage circuitry that is coupled to thethird line and that supplies a first voltage and a second voltagedifferent from the first voltage, wherein the first pixels are arrangedevery n rows in the one of the columns, and the second pixels arearranged every n rows in the one of the columns, where n is an integerequal to or greater than two, the rows respectively having the firstpixels being different from those respectively having the second pixels.2. The imaging device according to claim 1, wherein the photoelectricconverter includes a pixel electrode, a counter electrode, and aphotoelectric conversion layer located between the pixel electrode andthe counter electrode, and the pixel electrode is coupled to the firstgate.
 3. The imaging device according to claim 1, wherein each of thepixels further comprises a second transistor, the second transistor ofeach of the first pixels is coupled between the first line and the oneof the first source and the first drain of corresponding one of thefirst pixels; and the second transistor of each of the second pixels iscoupled between the second line and the one of the first source and thefirst drain of corresponding one of the second pixels.
 4. The imagingdevice according to claim 1, further comprising: column circuitry thataccepts output signals from the first pixels and the second pixels; andswitching circuitry that is coupled between the first line and thecolumn circuitry and that is coupled between the second line and thecolumn circuitry, the switching circuitry electrically coupling eitherthe first line or the second line to the column circuitry.
 5. Theimaging device according to claim 1, wherein the pixels further includesthird pixels and fourth pixels in the one of the columns, the thirdpixels being different from the first and second pixels, the fourthpixels being different from the first to third pixels, the imagingdevice further comprising: a fourth line coupled to one of the firstsource and the first drain of each of the third pixels, the fourth linebeing different from the first and second lines; and a fifth linecoupled to one of the first source and the first drain of each of thefourth pixels, the fifth line being different from the first to fourthlines, and the first pixels are arranged every 4 rows in the one of thecolumns, and the second pixels are arranged every 4 rows in the one ofthe columns.
 6. The imaging device according to claim 5, wherein thethird pixels are arranged every 4 rows in the one of the columns, andthe fourth pixels are arranged every 4 rows in the one of the columns,the rows respectively having the first pixels, the rows respectivelyhaving the second pixels, the rows respectively having the third pixelsand the rows respectively having the fourth pixels being different fromone another.
 7. The imaging device according to claim 1, wherein each ofthe pixels includes a second transistor having a second gate, a secondsource and a second drain, either the first source or the first drainbeing configured to electrically couple to the photoelectric convertervia the second transistor.
 8. The imaging device according to claim 1,wherein the voltage circuitry supplies only the first voltage and thesecond voltage.
 9. An imaging device, comprising: a first pixel and asecond pixel different from the first pixel, the first pixel and thesecond pixel being located in the same column, each of the first pixeland the second pixel comprising: a photoelectric converter that convertsincident light into signal charge, and a first transistor having a firstgate, a first source and a first drain, the first gate being coupled tothe photoelectric converter; a first line coupled to one of the firstsource and the first drain of the first pixel; a second line coupled toone of the first source and the first drain of the second pixel, thesecond line being different from the first line; and voltage circuitrythat is configured to supply a first voltage and a second voltagedifferent from the first voltage to the other of the first source andthe first drain of each of the first pixel and the second pixel.
 10. Theimaging device according to claim 9, further comprising: a third linethat is coupled to the other of the first source and the first drain ofeach of the first pixel and the second pixel, the voltage circuitrybeing coupled to the other of the first source and the first drain ofeach of the first pixel and the second pixel via the third line.
 11. Theimaging device according to claim 9, wherein the photoelectric converterincludes a pixel electrode, a counter electrode, and a photoelectricconversion layer located between the pixel electrode and the counterelectrode, and the pixel electrode is coupled to the first gate.
 12. Theimaging device according to claim 9, wherein each of the first pixel andthe second pixel further comprises a second transistor, the secondtransistor of the first pixel is coupled between the first line and theone of the first source and the first drain of the first pixel; and thesecond transistor of the second pixel is coupled between the second lineand the one of the first source and the first drain of the second pixel.13. The imaging device according to claim 9, wherein each of the firstpixel and the second pixel includes a second transistor having a secondgate, a second source and a second drain, either the first source or thefirst drain being configured to electrically couple to the photoelectricconverter via the second transistor.
 14. The imaging device according toclaim 9, wherein the voltage circuitry supplies only the first voltageand the second voltage.
 15. An imaging device, comprising: a first pixeland a second pixel different from the first pixel, the first pixel andthe second pixel being located in the same column, each of the firstpixel and the second pixel comprising: a photoelectric converter thatconverts incident light into signal charge, and a first transistorhaving a first gate, a first source and a first drain, the first gatebeing coupled to the photoelectric converter; a first line coupled toone of the first source and the first drain of the first pixel; a secondline coupled to one of the first source and the first drain of thesecond pixel, the second line being different from the first line; firstvoltage circuitry that is configured to supply a first voltage and asecond voltage different from the first voltage to the other of thefirst source and the first drain of the first pixel, and second voltagecircuitry that is configured to supply the first voltage and the secondvoltage to the other of the first source and the first drain of thesecond pixel.
 16. The imaging device according to claim 15, furthercomprising: a third line coupled to the other of the first source andthe first drain of the first pixel, the first voltage circuitry beingcoupled to the other of the first source and the first drain of thefirst pixel via the third line, and a fourth line coupled to the otherof the first source and the first drain of the second pixel, the secondvoltage circuitry being coupled to the other of the first source and thefirst drain of the second pixel via the fourth line.
 17. The imagingdevice according to claim 15, wherein the photoelectric converterincludes a pixel electrode, a counter electrode, and a photoelectricconversion layer located between the pixel electrode and the counterelectrode, and the pixel electrode is coupled to the first gate.
 18. Theimaging device according to claim 15, wherein each of the first pixeland the second pixel further comprises a second transistor, the secondtransistor of the first pixel is coupled between the first line and theone of the first source and the first drain of the first pixel; and thesecond transistor of the second pixel is coupled between the second lineand the one of the first source and the first drain of the second pixel.19. The imaging device according to claim 15, wherein each of the firstpixel and the second pixel includes a second transistor having a secondgate, a second source and a second drain, either the first source or thefirst drain being configured to electrically couple to the photoelectricconverter via the second transistor.
 20. The imaging device according toclaim 15, wherein the first voltage circuitry supplies only the firstvoltage and the second voltage, and the second voltage circuitrysupplies only the first voltage and the second voltage.